Carrier-Supported Fan-Out Packaging for Flat Re-Distribution Layers

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The existing fan-out package method for semiconductor devices often results in warpage or distortion of the die redisposition body during the removal of the temporary fixing material, leading to degraded flatness and difficulty in forming fine re-distribution layers.

Innovation Solution

A method involving the use of a temporary fixing structure where semiconductor elements are attached to a carrier through a curable bonding adhesive layer, which is then cured, allowing the temporary fixing material to be removed while the carrier maintains the elements' position, thereby improving flatness and enabling the formation of finer re-distribution layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the temporary fixing material is removed after encapsulation, then the semiconductor elements can be freed from the temporary substrate, but warpage or distortion occurs in the die redisposition body causing degraded flatness

Engineering Contradiction:

Improveflatness of die redisposition bodyVSAvoidprocess complexity for maintaining flatness

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

A carrier is attached to the back surface of the semiconductor element before encapsulation. This preliminary action ensures that when the temporary fixing material is later removed, the carrier provides structural support to prevent warpage or distortion of the die redisposition body, thereby maintaining flatness without adding complex process steps.

Inventive Principle:

Principle #10Preliminary action

2Manufacturing precision

If the carrier is fixed with strong bonding adhesive, then the semiconductor element is rigidly fixed reducing displacement, but the bonding adhesive strength is too high to allow simple carrier removal by laser irradiation

Engineering Contradiction:

Improvepositioning accuracy of semiconductor elementVSAvoidcarrier removal efficiency

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The bonding adhesive layer is designed with specific physical and chemical parameters that allow it to exhibit strong bonding strength under normal conditions for precise positioning, while also containing light-absorbing components that enable controlled decomposition and detachment when exposed to laser irradiation, thus achieving both precise positioning and easy removal.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The bonding adhesive layer undergoes a phase transition or chemical decomposition when exposed to laser irradiation. The laser energy causes the adhesive to decompose or change its bonding properties, allowing the carrier to be easily removed after the semiconductor element has been securely positioned and processed.

Inventive Principle:

Principle #36Phase transitions

3Reliability

If a thick curable bonding adhesive layer is used, then the carrier is strongly fixed to the temporary fixing structure body suppressing warpage, but the overall device height increases

Engineering Contradiction:

Improvesuppression of warpageVSAvoidheight of semiconductor device

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The bonding adhesive layer is formulated as a composite material that combines structural support properties with low thickness. This composite adhesive provides sufficient mechanical strength to suppress warpage of the die redisposition body while maintaining a thin profile that does not significantly increase the overall device height.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the flatness of the die redisposition body, allowing for the formation of finer re-distribution layers and reduces the risk of warpage and distortion, while also simplifying the manufacturing process and reducing the need for additional protective layers.

Implementation Method 1

fixing the plurality of semiconductor elements to the carrier by curing the curable bonding adhesive layer through the cured curable bonding adhesive layer

Methodology Applied

Scientific EffectCuring: Photopolymerisation

Implementation Method 2

irradiating a laser beam to the bonding adhesive layer from the carrier side, thereby heating and decomposing the bonding adhesive layer

Methodology Applied

Scientific EffectLaser heating: Laser

Implementation Method 3

heating and decomposing the bonding adhesive layer

Methodology Applied

Scientific EffectDecomposition: Pyrolysis

Data Source

PatentUS12593657B2Method for manufacturing semiconductor device by removing carrier after forming re-distribution layer

Publication Date: 2026.03.31 RESONAC CORP

AI summary

A method for manufacturing a semiconductor device includes preparing a temporary fixing structure body in which semiconductor elements each including a first surface on which a connection terminal is formed and a second surface are attached to a temporary fixing material, forming a curable bonding adhesive layer on the second surface of each of the semiconductor elements, attaching a carrier to one surface of the curable bonding adhesive layer opposite to the semiconductor elements, fixing the semiconductor elements to the carrier by curing the curable bonding adhesive layer, and removing the temporary fixing material. The semiconductor elements are attached onto the temporary fixing material such that the first surface of each of the semiconductor elements is directed toward the temporary fixing material, and are encapsulated with an encapsulant material such that the second surface of each of the semiconductor elements is exposed from an encapsulant material layer.