Catalyst Precursor Resin for Electroless Plating Micro Patterns
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Solution Overview
Problem
Existing methods for forming electromagnetic shielding layers, such as those used in displays, face challenges including high surface resistance, complex procedures, metal waste, pattern detachment in strong alkaline solutions, and limited precision in forming micro patterns, particularly in electroless plating processes.
Innovation Solution
A catalyst precursor resin composition comprising a copolymer with a carboxyl group and maleimide monomer, a fluorinated-organic complex of silver ion, multifunctional ethylene-unsaturated bonds, a photoinitiator, and an organic solvent, which forms a catalyst pattern layer that is stable and adhesive, reducing catalyst loss and enabling efficient electroless plating for micro pattern formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a thin conductive film is deposited to provide transparency, then transparency is improved, but surface resistance becomes too high to achieve sufficient electromagnetic shielding effect
Solution Approach 1:
The invention uses a composite structure consisting of a transparent substrate with a conductive film deposited thereon. The conductive film is formed through electroless plating using a catalyst precursor resin composition containing silver ion complex and copolymer, creating a composite material system that achieves both transparency and sufficient conductivity for electromagnetic shielding
Solution Approach 2:
The invention changes the chemical state and distribution parameters of the conductive film by using electroless plating with a catalyst precursor resin composition. This allows controlled deposition of metal particles forming a conductive network that maintains transparency while achieving adequate surface conductivity for electromagnetic shielding
2Reliability
If metal foil etching is used to form copper pattern, then conductive shielding film can be formed, but the procedure becomes long and complicated with much metal waste
Solution Approach 1:
The invention extracts and eliminates the photoresistor pattern formation and etching steps from the traditional metal foil etching process. Instead, it directly forms a conductive film through electroless plating on a transparent substrate, removing the complicated multi-step procedure while maintaining the ability to form conductive shielding patterns
Solution Approach 2:
The electroless plating process is self-catalytic, where the silver ion complex in the resin composition automatically reduces and deposits metal particles that catalyze further deposition. This self-service mechanism eliminates the need for external photoresistor patterns and etching chemicals, simplifying the overall process
3Device complexity
If printing conductive paste is used to form pattern, then procedure is simplified, but precision is limited and conductive materials sink into uneven parts
Solution Approach 1:
The invention replaces the mechanical printing process with a chemical deposition process (electroless plating). Instead of physically printing conductive paste that may sink or deform, metal particles are deposited chemically onto the substrate surface, eliminating sinking issues and achieving higher precision patterns while maintaining procedural simplicity
4Manufacturing precision
If photo development method with metal layer is used, then pattern can be formed, but several layers and complicated procedures are necessary
Solution Approach 1:
The invention merges the catalyst precursor resin layer and the conductive film formation into a single integrated process. The resin composition containing silver ion complex serves dual purposes as both the photoresist layer and the catalyst layer for electroless plating, eliminating the need for separate metal layer deposition and reducing the total number of processing steps
5Productivity
If metal catalyst is mixed with photosensitive resin, then electroless plating can be performed, but catalyst loss occurs during wet processing and pattern detachment happens in strong alkaline solution
Solution Approach 1:
The invention creates a composite material system where the silver ion complex is chemically bound to the copolymer resin matrix. This composite structure protects the catalyst from loss during wet processing and prevents pattern detachment in strong alkaline solutions, while maintaining electroless plating efficiency
Solution Approach 2:
The copolymer resin composition provides different functional properties in different regions: the hydrophobic regions protect the catalyst from water and alkaline solutions, while the hydrophilic regions allow controlled release for electroless plating. This local quality differentiation solves both catalyst loss and pattern detachment problems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a stable and adhesive catalyst pattern layer with reduced catalyst loss, improved deposition speed, and homogeneous micro pattern formation, suitable for electromagnetic shielding in displays and electronic components.
Implementation Method 1
electroless plating for micro pattern formation
Implementation Method 2
catalyst precursor resin composition comprising a copolymer with a carboxyl group and maleimide monomer, a fluorinated-organic complex of silver ion
Implementation Method 3
a photoinitiator, and an organic solvent, which forms a catalyst pattern layer
Data Source
AI summary
A catalyst precursor resin composition includes an organic polymer resin; a fluorinated-organic complex of silver ion; a monomer having multifunctional ethylene-unsaturated bonds; a photoinitiator; and an organic solvent. The metallic pattern is formed by forming catalyst pattern on a base using the catalyst precursor resin composition reducing the formed catalyst pattern, and electroless plating the reduced catalyst pattern. In the case of forming metallic pattern using the catalyst precursor resin composition, a compatibility of catalyst is good enough not to make precipitation, chemical resistance and adhesive force of the formed catalyst layer are good, catalyst loss is reduced during wet process such as development or plating process, depositing speed is improved, and thus a metallic pattern having good homogeneous and micro pattern property may be formed after electroless plating.