A photosensitive resin composition incorporating specific solvents and initiators to achieve high sensitivity and resolving ability.
A resist composition uses a polymeric acid generator to achieve high sensitivity and resolution.
Replacing solvent casting with melt-extrusion of cyclic acetal polyester eliminates residual solvents while achieving optical isotropy.
Composite resist reduces line width roughness and outgas generation while maintaining etching resistance.
A positive resist composition uses hydroxystyrene units and acid generators to form precise patterns.
A radiation-sensitive resin composition incorporating fluorine and silicon atoms to improve pattern formation quality.
Fluorinated silver ion complex in copolymer resin reduces catalyst loss during wet processing to form homogeneous micro patterns.
Novolak protective film absorbs out-of-band light to prevent thickness loss while enabling simultaneous stripping.
Adding a basic compound during copolymerization prevents decomposition of acid decomposable groups, reducing defects in resist films.
Heating and rinsing a resist pattern with benzalkonium chloride reduces line width roughness without altering the precise pattern dimensions.
Novolak and polyhydroxystyrene resin system with vinyl ether structures enables precise pattern formation in semiconductor manufacturing.
A supercritical processing solution introduces organic compounds into resist films before exposure to enhance sensitivity and etching resistance.
Composite silicon film suppresses photolithography reflection and maintains shelf stability through acid-catalyzed hydrolytic condensation.
A positive resist composition using silicon-free and silicon-containing resins enables uniform chemical reactions during immersion lithography exposure.
Segmented cladding layers and a graded-index core reduce transmission loss and pulse distortion caused by narrow channel pitch.
A divalent linking group connects acid-generating moieties in a resist composition to enhance lithography properties.
A novel copolymer structure enables high sensitivity and resolution in lithography applications.
A radical polymerizable composition with high-dipole binder polymers enables direct plate-making using UV or infrared lasers.
A positive tone photosensitive composition uses a modified phenol resin and thermal cross-linker to enhance sensitivity and resolution.