Magnetron Sputtering Cathode Target Rotation for Uniform Erosion

The patent applies the dynamics principle by making the target movable rather than stationary. The target is rotated or translated relative to the magnet array during sputtering, which dynamically changes the erosion pattern across the target surface. This movement ensures uniform material removal and consistent deposition quality on the substrate, resolving the contradiction between deposition uniformity and device complexity by introducing controlled motion to the target assembly.

The patent applies the inversion principle by reversing which component moves. Instead of rotating the magnet array (conventional approach), the target itself is rotated or translated relative to a stationary magnet array. This inversion achieves uniform target erosion through the moving target surface while maintaining a stable magnetic field configuration that produces consistent deposition patterns on the substrate, thereby resolving the contradiction between target utilization and deposition uniformity.

The patent applies the dynamics principle to resolve the contradiction between large target area and erosion uniformity. By implementing target rotation or translation, the entire large target surface is dynamically exposed to the magnetic field over time. This ensures that even regions of the target that are not simultaneously covered by the magnet array receive uniform erosion through periodic exposure, enabling large-area substrate coverage while maintaining consistent deposition quality.