Cavity-Integrated Electronic Package Structure for Space Optimization
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Solution Overview
Problem
Conventional electronic package structures have low spatial utilization and large sizes due to the surface disposition of electronic elements, leading to inefficient use of internal space.
Innovation Solution
The electronic package structure incorporates a second electronic element with a cavity to house the first electronic elements and a lead frame, allowing for increased internal space utilization by either disposing the first electronic elements within the cavity or stacking the second electronic element on the first, along with an insulating or magnetic encapsulant for protection and enhanced mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic elements are disposed on the surface of the PCB or circuit substrate, then the electrical connection is achieved, but the spatial utilization is low and the size is large
Solution Approach 1:
The patent applies nesting by placing the first electronic element inside the cavity of the second electronic element. The cavity of the second element serves as a housing for the first element, creating a nested configuration that maximizes space utilization within the package structure.
Solution Approach 2:
The patent transitions from traditional surface-mounted two-dimensional arrangement to a three-dimensional configuration by stacking electronic elements vertically. The first electronic element is positioned inside the cavity of the second element, utilizing the vertical dimension to reduce the overall package footprint.
2Ease of manufacture
If electronic elements are disposed on the surface only, then the manufacturing process is simple, but the spatial utilization is low
Solution Approach 1:
The nested configuration of placing one electronic element inside another is designed to be compatible with conventional manufacturing processes. The lead frame structure with integrated leads facilitates this nested arrangement without requiring complex assembly steps, maintaining ease of manufacture while improving space utilization.
3Reliability
If the lead frame leads extend to the cavity to connect electronic elements, then the electrical connection is achieved, but the structural complexity increases
Solution Approach 1:
The lead frame is designed to serve multiple functions: it provides structural support for the electronic elements, establishes electrical connections between elements disposed in the cavity and external circuits, and facilitates the nested configuration. This multi-functionality reduces the need for additional separate components, thereby managing structural complexity while ensuring reliable electrical connectivity.
Data Source
AI summary
An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.