An inner metal layer embedded in the component body prevents plating material spread, eliminating short circuit risks during miniaturization.
A chip inductor uses a metal-polymer composite and plating to form a coil, reducing DC resistance and magnetic saturation.
Nested shielding layer on the body surface reduces magnetic flux leakage while maintaining thin component profiles.
Simultaneous photolithography forms external electrodes and coil conductors on shared insulator layers to ensure precise positional alignment.
A cavity-integrated electronic package structure houses internal elements within a secondary component body to maximize spatial utilization.
A composite magnetic core reactor combines ferrite and soft magnetic metal to guide flux efficiently.
A reactor design uses a through hole in the outer core to fill winding gaps with resin.
Divisional pieces with protrusions maintain core intervals, eliminating gap plates and simplifying assembly for improved productivity.
Segment drying before assembly to reduce moisture absorption in cellulose insulation and hazardous worker exposure.
A coiled conductor embedded in a pressure-molded magnetic body achieves over 80% metal powder filling factor without insulating films.