Inductance Part with Embedded Conductor and High-Filling Magnetic Body
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Solution Overview
Problem
Conventional inductance parts face limitations in miniaturization due to a maximum filling factor of metal magnetic powder of 75% by volume, which restricts the increase in relative magnetic permeability and further miniaturization, especially when high pressure molding damages insulating films and leads to short-circuits.
Innovation Solution
The inductance part is designed with a coiled conductor embedded in a magnetic body formed by pressure-molding a mixture of metal magnetic powder and bonding material, where the metal magnetic powder penetrates into the conductor's surface, achieving a filling factor of over 80% by volume, eliminating the need for insulating films and allowing higher pressure molding without short-circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulating film is provided on the surface of ring parts to prevent short-circuit, then reliability is improved, but manufacturing precision deteriorates because the insulating film is damaged by high pressure molding
Solution Approach 1:
The patent removes the insulating film from the ring parts entirely. Instead of trying to protect the insulating film during molding, the invention extracts this component and replaces its function through a different mechanism: the magnetic powder itself provides electrical insulation between adjacent ring parts while enabling high-pressure molding to achieve superior filling factors.
Solution Approach 2:
The patent changes the pressure parameter during molding from conventional levels (196-392 MPa) to ultra-high pressure (490-980 MPa). This parameter change enables the filling factor to increase from 75% to 85-95%, and the magnetic powder's electrical insulation properties become sufficient to prevent short-circuits without requiring an additional insulating film layer.
2Productivity
If pressure-molding is performed at high pressure to increase filling factor, then productivity is improved, but manufacturing precision deteriorates due to damage of insulating film and breaking of ring parts
Solution Approach 1:
The insulating film is extracted from the system, eliminating the vulnerability to high-pressure damage. The ring parts are designed to be molded directly without this protective layer, allowing the full benefits of ultra-high pressure molding to be realized.
Solution Approach 2:
The patent applies beforehand cushioning by selecting magnetic powder with appropriate hardness and elastic modulus that is softer than the ring parts. This material selection acts as a cushion during molding, preventing the magnetic powder from damaging the ring parts even at ultra-high pressures of 490-980 MPa.
3Volume of moving object
If filling factor of metal magnetic powder is increased to miniaturize inductance parts, then volume is reduced, but reliability deteriorates due to short-circuit caused by insulating film damage
Solution Approach 1:
The insulating film is removed from the design, and its electrical insulation function is transferred to the magnetic powder itself. This eliminates the reliability issue associated with insulating film damage while maintaining electrical isolation between conductive ring parts.
Solution Approach 2:
The patent changes the filling factor from conventional 75% to ultra-high 85-95%. At this elevated filling factor, the magnetic powder densely packs around the ring parts, providing both mechanical support and electrical insulation, thereby preventing short-circuits even without an insulating film.
4Manufacturing precision
If conventional pressure-molding is used to maintain insulating film integrity, then manufacturing precision is preserved, but productivity deteriorates due to limitation in filling factor
Solution Approach 1:
By removing the insulating film constraint, the patent enables the use of ultra-high pressure molding (490-980 MPa) that would otherwise be prohibited. This extracts the limiting factor and allows the filling factor to increase from 75% to 85-95%.
Solution Approach 2:
The patent implements a parameter change in molding pressure from the conventional range (196-392 MPa) to ultra-high pressure (490-980 MPa). This parameter change directly increases the filling factor while the removed insulating film eliminates the associated reliability risk.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the relative magnetic permeability, enabling the miniaturization of inductance parts to dimensions such as 2 mm wide, 2 mm deep, and 1 mm high, while preventing mechanical stress and cracks, and reducing high-frequency current losses by increasing the current flow area.
Implementation Method 1
a magnetic body formed by pressure-molding a mixture of metal magnetic powder and bonding material in such a manner that the coiled conductor is embedded in the mixture
Implementation Method 2
metal magnetic powder having a high saturation magnetic flux density at a high-frequency current
Data Source
AI summary
Disclosed is an inductance part including a coiled conductor formed from a metal conductor, a magnetic body formed by pressure-molding a mixture of metal magnetic powder and bonding material in such a manner that the coiled conductor is embedded in the mixture, and a terminal derived from the coiled conductor. The coiled conductor is formed in a single layer with no insulating film on its surface. The metal magnetic powder of the magnetic body penetrates into the surface of the coiled conductor so as to make the filling factor of the metal magnetic powder in the magnetic body not less than 80% by volume.