Cavity-Bearing PCB with Embedded Component and EMI Shielding
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Solution Overview
Problem
Modern printed circuit boards face challenges in accommodating miniaturized electronic components due to size limitations, often requiring costly redesigns or extended fabrication timelines when trying to fit components within available vertical space.
Innovation Solution
The solution involves creating a cavity on one side of the printed circuit board with EMI-shielding material and electrically-conductive metal, allowing an electronic component to be partially housed within, reducing overall height and providing EMI protection, while maintaining flexibility for various component sizes and form factors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If electronic components are mounted on the surface of a printed circuit board, then electrical connection is achieved, but the overall height of the assembly increases
Solution Approach 1:
The electronic component is nested within a cavity formed in the printed circuit board substrate. The cavity has side walls and a bottom that receive and hold the component, allowing it to be partially housed within the board structure rather than mounted on the surface. This nesting approach reduces the overall height of the assembly while maintaining electrical connection through conductive traces that extend into the cavity and connect to the component's contact pads.
2Length of moving object
If a cavity is formed in the printed circuit board to house the component, then overall height is reduced, but EMI protection is compromised
Solution Approach 1:
The cavity is formed in a laminate structure comprising multiple layers including an EMI-shielding layer. This EMI-shielding layer is disposed between the component and the cavity walls, providing electromagnetic interference protection while the cavity structure itself provides the height reduction. The laminate combines different material properties: the substrate provides structural support, the EMI-shielding layer provides electromagnetic protection, and together they enable both height reduction and EMI protection simultaneously.
3Area of stationary object
If custom redesign of electronic components is performed to meet space limitations, then space constraints are satisfied, but manufacturing cost and fabrication time increase
Solution Approach 1:
Instead of redesigning the electronic component to fit space constraints, the invention changes the mounting dimension by forming a cavity within the printed circuit board substrate. This allows the component to be positioned in a different spatial arrangement (partially embedded rather than surface-mounted) without modifying the component itself. The cavity formation and component mounting can be performed using existing manufacturing facilities and processes, avoiding the need for custom component redesign and reducing both cost and fabrication time.
Data Source
AI summary
A printed circuit board has a cavity formed in at least one side thereof and an electronic component disposed at least partially within that cavity. Electromagnetic interference (EMI)-shielding material is disposed between the electronic component and at least one of the side walls and bottom of this cavity. So configured, the overall height of the combined structure is reduced as compared to a surface-mounted component.