Printed Circuit Aspects TRIZ Cases

A cavity-bearing printed circuit board houses an electronic component within a substrate void to reduce overall assembly height.

A paddle card uses segmented ground planes to maintain impedance matching for high-speed differential signals.

Accumulation recesses in the cover partition contain bonding material to prevent sensor corrosion and ensure predictable attachment strength.

A multi-component marker system generates unique identifiers by reading proxy values in a predetermined sequence across distributed assembly portions.

A resin composition with a specific cyanate ester and phenolic resin ratio enhances curing properties.

Silane compounds and monomer ratios balance adhesion with scratch resistance on flexible polyimide circuits.

A flexible circuit board passes through a slit in a heat dissipating plate to arrange light-emitting units on one side and driver units on the other.

A BNC edge mount connector interface uses a tapered waveguide section to transition signal pad width to microstrip trace dimensions for controlled electrical conductivity.

A resin-metal composite release film prevents chemical penetration into cladding faces during thermal compression.

Discrete metallic contact between metal substrate and heat sink eliminates air gaps, reducing thermal resistance without screw connections or paste.

Laminating conductors between insulating layers replaces manual bundling, enabling automated production of branched cable assemblies.

Wet etching removes catalyst metal particles from the substrate surface, preventing non-electrolytic plating deposition in gaps between wiring structures.

Segmented island regions in multilayer PCB blank areas prevent insulating material flow and surface wrinkles while maintaining radio signal propagation.

Barium-doped SrLiAl3N4 phosphors emit narrow-band red light to resolve YAG phosphor deficiencies in color rendering and temperature stability.

Segmented cantilever springs increase energy storage capacity and compliance without expensive alloys, reducing frictional losses in electrical connections.

Biasing members engage the module circuit board within tower ledges to ensure accurate alignment and prevent contact damage during mating.

Insulating plate with through holes houses busbars contacting a heat dissipation plate for efficient thermal transfer.

A spacer part made of non-magnetic material sits between internal coil parts to suppress magnetic field interference.

Thin metal lines connect display panel pads to circuit board parts, reducing seam gaps caused by bulky bonding areas.

Multiple pins inside plated through holes reduce thermal resistance between solder pads without increasing drill density.

Placing termination resistors adjacent to I/O pins reduces signal reflections and noise interference near the source.

Interlaced coplanar electrodes boost capacitance without expanding the footprint, resolving space constraints while maintaining impedance matching.

A dispersing element containing copper oxide, a reductant, and a dispersing agent forms conductive patterns via controlled reduction.

Lines on glass transmit power and signals between PCBs and COFs, eliminating flexible films to reduce fabrication costs.

Segmented traveling wires with perforations and planar contacts prevent cracking in narrow edge frames.

A cured resin layer incorporates ultrafine inorganic filler particles to achieve a low thermal expansion coefficient and high elastic modulus.

Segmented insulative masks on the anode control electrodeposition to resolve thickness non-uniformity and reduce weight deviation below 2.0%.

A semiconductor bus rearranges signal supply order to memory chips, extending specific path lengths without increasing physical device size.

A flexible wiring board uses a mesh conductive portion with intersecting line portions to suppress electromagnetic noise.

Segmented lithium ion battery module delivers 12V and 48V outputs to simplify hybrid vehicle conversion while maintaining compact form factor.

Micro via thermal arrays transfer heat through printed circuit board layers to integrated cooling components.

Selective photoresist masking removes unmasked metal layers to expose the substrate, eliminating alignment tolerance constraints that limit layout density.

Direct welding of fixed pins joins plates to eliminate loose screws and maintain sealing stability.

Distributing semiconductor elements across opposite base surfaces reduces substrate size while maintaining electrical insulation between conductive plates.

Stepped-diameter alignment pins secure RF dielectric waveguide filters to substrates, resolving mounting difficulty and ensuring precise pad registration.

Extending module connects third connector to low profile PCB via integrated traces, eliminating suspended cables and signal interference.

Directly soldering non-detachable circuit breakers onto the power distributor board simplifies mounting time while preventing incorrect insertion hazards.

Nesting an insulator around an RFID memory medium eliminates gaps and simplifies manufacturing by removing surface flattening steps.

Asymmetric connecting parts align coil sections to reduce pattern types while maintaining inner diameter for high inductance.

Positioning members couple magnetic pieces at regular intervals within a substrate cavity, stabilizing gap sizes and reducing magnetic flux leakage.

A combined fastening and contacting system uses a holding frame and pressing frame to secure superimposed circuit boards without adhesives.

Recessed memory card terminals guide socket pins to prevent misalignment and ensure stable power transmission.

A DIMM retainer constrains top edges of memory modules to inhibit vibration-induced movement that causes intermittent electrical discontinuity.

A support element arrangement positions a second sensor vertically relative to a first main extension plane using nested structural geometry.

A wiring board uses balanced thermal expansion coefficients across insulating layers to stabilize the structure.

Bonding the polarizer directly to the touch sensor unit reduces bezel width and enhances flexibility while maintaining optical transmittance.

A printed board slit supports a conductive member bridging a high-voltage spring contact, resolving unstable connection and assembly force issues.

Silver palladium paste fills micro vias through particle growth, reducing porosity and resistivity in high aspect ratio structures.