Flexible Circuit Board for LED Backlight Heat Dissipation
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Solution Overview
Problem
Displays with direct backlight require high LED disposition density, leading to uneven LED arrangement and reduced heat dissipation efficiency due to the placement of driver chips and LEDs on the same side of the heat dissipating plate.
Innovation Solution
The design includes a heat dissipating plate with slit structures allowing flexible circuit boards to be arranged on both sides, enabling driver units to be placed on one side while light-emitting units remain flatly arranged on the other, improving heat dissipation and uniform backlight distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the disposition density of LEDs is increased to achieve higher brightness, then the luminous output is improved, but the heat dissipation efficiency deteriorates due to uneven LED arrangement on the heat dissipating plate
Solution Approach 1:
The flexible circuit board is folded along a folding line to extend in a direction substantially perpendicular to the first surface of the heat dissipating plate. This dimensional change allows the circuit board to accommodate high-density LED arrangements while maintaining proper spacing and heat dissipation pathways, resolving the contradiction between brightness and heat dissipation efficiency.
2Device complexity
If driver chips and LEDs are disposed at the same side of the heat dissipating plate to simplify structure, then the device complexity is reduced, but the LEDs cannot be arranged flatly which reduces heat dissipation efficiency
Solution Approach 1:
The folding structure allows the circuit board to utilize the third dimension (perpendicular direction) to separate the placement of driver chips and LEDs while maintaining electrical connectivity. This resolves the contradiction by enabling flat LED arrangement for heat dissipation while keeping the structure integrated.
Solution Approach 2:
The circuit board is folded back onto itself, creating a nested configuration where driver chips and LEDs are positioned on different segments of the same flexible circuit board. This nesting approach maintains structural simplicity while achieving proper spatial separation for heat dissipation.
3Illumination intensity
If the disposition density of LEDs is increased to achieve higher brightness, then the luminous output is improved, but the arrangement uniformity deteriorates leading to uneven LED placement
Solution Approach 1:
By folding the circuit board perpendicular to the heat dissipating plate surface, the design creates additional spatial room to maintain uniform spacing between high-density LEDs. This dimensional extension allows high brightness achievement while preserving arrangement uniformity and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for higher LED density without compromising heat dissipation efficiency, ensuring uniform backlight and effective cooling for the LEDs.
Implementation Method 1
the LEDs can be arranged flatly and cooled through the heat dissipating plate
Data Source
AI summary
A display device includes a display panel and a backlight module disposed adjacent to the display panel. The backlight module includes a heat dissipating plate, a flexible circuit board disposed on the heat dissipating plate, and a plurality of light-emitting units disposed on the flexible circuit board. In some embodiments, the heat dissipating plate has a slit. The flexible circuit board can pass through the slit so as to be disposed at two opposite surfaces of the heat dissipating plate. In some embodiments, the surface of the heat dissipating plate toward the display panel thereon forms an indentation structure. A driver unit of the flexible circuit board can be disposed in the indentation structure.