RF Filter Assembly Alignment Pins for Waveguide Mounting

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Solution Overview

Problem

Existing RF dielectric filter assemblies face challenges in accurate and efficient alignment and mounting on substrates due to the lack of effective alignment and mounting mechanisms for RF signal input/output transmission pins.

Innovation Solution

The RF filter assembly employs conductive metal pins with different diameters extending into substrate and filter apertures, along with dielectric blocks with through-holes and steps, to facilitate precise alignment and mounting of the RF dielectric waveguide filter on a substrate, ensuring proper alignment with RF signal transmission pads.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If traditional mounting methods are used for RF dielectric filter assemblies, then the filter can be mounted on the substrate, but accurate alignment with RF signal transmission pads is difficult to achieve

Engineering Contradiction:
Improvealignment accuracyVSAvoidmounting difficulty
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The patent introduces alignment pins as intermediary elements between the RF dielectric filter and the substrate. These pins extend through apertures in both components and provide precise mechanical alignment, ensuring that the filter's RF signal transmission pads align accurately with corresponding pads on the substrate. The pins act as a mediator that translates the mounting function into a precise alignment function.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The alignment pins are designed with different diameter sections that fit into correspondingly sized apertures. The first section with a first diameter fits into the first aperture in the substrate, while the second section with a second diameter fits into the second aperture in the filter. This preliminary structural design establishes the alignment relationship before final mounting, making the assembly process easier and more accurate.

Inventive Principle:
Principle #10Preliminary action

2Measurement precision

If alignment pins with different diameter sections are used, then alignment accuracy is improved, but the device complexity increases

Engineering Contradiction:
Improvealignment precisionVSAvoidpin structure complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The alignment pin is designed to perform multiple functions: it provides mechanical support, ensures precise alignment, and facilitates easy assembly. The different diameter sections serve both alignment and assembly guidance functions simultaneously. This multi-functionality reduces the need for separate alignment features, thereby managing complexity while improving precision.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The pin structure employs asymmetry with different diameter sections (first section with first diameter, second section with second diameter). This asymmetric design allows the pin to fit into correspondingly asymmetric apertures in the substrate and filter, providing precise alignment while the gradual transition between diameters facilitates easy insertion and assembly.

Inventive Principle:
Principle #4Asymmetry

Data Source

PatentUS9583805B2RF filter assembly with mounting pins
Publication Date: 2017.02.28 CTS CORP
  • US9583805B2 patent drawing
  • US9583805B2 patent drawing
  • US9583805B2 patent drawing

AI summary

An RF filter assembly comprising a substrate, an RF waveguide filter mounted on the substrate and a pair of alignment/mounting/RF signal transmission pins extending from respective apertures in the substrate into respective through-holes in the RF filter. In one embodiment, the RF waveguide filter is comprised of first and second blocks of dielectric material coupled together in an abutting side-by-side relationship and the pair of through-holes are defined in the first and second blocks respectively. In one embodiment, respective RF signal transmission pads defined on the respective first and second blocks of dielectric material are abutted against respective RF signal transmission pads defined on the substrate and interconnected by an RF signal transmission line in the interior of the substrate for transmitting the RF signal between the first and second blocks of dielectric material.