Substrate Structure with Opposite-Surface Element Mounting
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Solution Overview
Problem
Existing substrate structures with bus bars and semiconductor switching elements are large due to the arrangement of elements on a single plane, limiting further size reduction.
Innovation Solution
A substrate structure with a base substrate featuring two conductive plates on the same plane, electrically insulated from each other, where elements are mounted on opposite surfaces, allowing for overlapping and dispersed placement to minimize size and enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple semiconductor switching elements are mounted on one main surface of bus bars arranged side by side on the same plane, then the elements can be connected to bus bars, but the substrate structure size cannot be further reduced
Solution Approach 1:
The patent transitions from mounting all elements on a single plane to distributing elements across multiple planes (first main surface and second main surface opposite to each other). This dimensional change allows elements to be arranged in three-dimensional space, reducing the footprint area required for the substrate structure while maintaining all necessary electrical connections.
2Area of stationary object
If bus bars are arranged side by side on the same plane, then connections are simplified, but the substrate structure size is increased
Solution Approach 1:
The patent segments the element mounting process into two distinct surfaces (first main surface and second main surface) of the base substrate. This segmentation allows elements to be distributed across both surfaces, reducing the area concentration on a single plane while maintaining manufacturing feasibility through standardized mounting processes on each surface.
3Volume of moving object
If elements are mounted on opposite surfaces of the base substrate, then the substrate structure size is reduced, but connection complexity increases
Solution Approach 1:
The base substrate serves multiple functions simultaneously: it provides mechanical support for elements on both surfaces, provides electrical insulation between conductive plates, and provides mounting surfaces for elements. This multi-functionality simplifies the overall structure by consolidating multiple components into a single base substrate, reducing the need for additional connection structures.
Data Source
AI summary
An object of the present disclosure is to be able to further reduce the size of a substrate structure including a plurality of elements. The substrate structure includes: a base substrate that includes a first conductive plate and a second conductive plate; a first element connected to the first conductive plate and the second conductive plate; and a second element connected to the first conductive plate and the second conductive plate. The first conductive plate and the second conductive plate are disposed on the same plane on the base substrate in a state of being electrically insulated from each other, the first element is mounted on a first main surface of the base substrate, and the second element is mounted on a second main surface that is on the opposite side to the first main surface relative to the base substrate.