Splicing Display Screen Thin Metal Line Interconnects
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Solution Overview
Problem
Conventional splicing display screens suffer from overly large seams due to the bulky bonding areas of chip on films or flexible circuit boards, which affect the display effect and are difficult to bend, leading to noticeable seams when spliced.
Innovation Solution
A splicing display screen design featuring a circuit board with metal connection areas, display panels with metal connection pads, and thin metal lines that reduce seam gaps by electrically connecting the pads to metal parts, along with a sealing layer and adhesive parts to secure the panels, minimizing seam width and improving display quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If chip on film or flexible circuit board is used for bonding, then electrical connection between PCB and glass substrate is achieved, but bonding area width becomes overly large
Solution Approach 1:
The patent uses a thin film flexible circuit board as the bonding substrate, which maintains electrical connection functionality while significantly reducing the bonding area width compared to conventional rigid bonding methods. The thin film structure allows for compact integration without compromising electrical reliability.
Solution Approach 2:
The patent transitions from planar bonding area expansion to three-dimensional vertical stacking by folding the flexible circuit board. This dimensional change allows multiple bonding operations to occur in close proximity without requiring large lateral bonding areas, thus reducing the overall bonding area width while maintaining all necessary electrical connections.
2Reliability
If bonding area is made large to accommodate chip on film, then electrical connection is ensured, but display screen appearance is affected
Solution Approach 1:
The thin film flexible circuit board enables compact bonding area design that does not protrude or create visible distortions on the display screen surface. The flexibility allows the bonding structure to be integrated within the display boundaries, maintaining a clean and uniform appearance.
Solution Approach 2:
By folding the flexible circuit board vertically and stacking bonding areas in three dimensions, the patent eliminates the need for large lateral bonding areas that would affect display appearance. The bonding structures are contained within the display footprint, preserving aesthetic quality.
3Stability of the object's composition
If polyimide base material is used for chip on film, then good resilience is achieved, but bending difficulty increases seam visibility
Solution Approach 1:
The patent employs an ultra-thin flexible circuit board with thickness of 1-3 μm, which is significantly thinner than conventional polyimide films. This extreme thinness provides sufficient flexibility for easy bending and positioning while eliminating the rigidity that causes seam visibility. The thin film can conform perfectly to the display surface, ensuring seamless integration.
Solution Approach 2:
The patent changes the critical parameter of film thickness from conventional ranges (typically >10 μm) to an ultra-thin range of 1-3 μm. This parameter change fundamentally alters the mechanical properties, providing both the needed flexibility for bending and the thinness required to eliminate visible seams, while maintaining resilience through the flexible material composition.
Data Source
AI summary
A splicing display screen is provided. The splicing display screen includes a circuit board, a plurality of display panels, and a plurality of first metal lines. The circuit board includes a plurality of circuit areas, and each of the circuit areas includes one of mounting areas and one of electrical connection areas. A plurality of first metal parts are disposed in the electrical connection areas. The display panels are disposed on the circuit board and positioned in the mounting areas, and metal connection pads on the display panels are electrically connected to the first metal parts by the first metal lines.