Uniform Electrodeposited Copper Foil via Insulative Anode Masks
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Solution Overview
Problem
The production of electrodeposited copper foil often results in non-uniform thickness, leading to tears, curling, and wrinkles, which reduces the efficiency and lifespan of electronic devices such as batteries and circuit boards due to variations in thickness.
Innovation Solution
The use of insulative masks cut to correspond to the thickness profile of the electrodeposited copper foil is implemented to adjust the plating time and copper deposition, ensuring uniform thickness by interfering with the electrodeposition process where necessary, thereby minimizing or eliminating thickness variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional electrodeposition is used without insulative masks, then the manufacturing process is simple, but the thickness uniformity of copper foil deteriorates
Solution Approach 1:
The anode is segmented into multiple sections with insulative masks applied to specific regions. This segmentation allows different portions of the anode to have different conductivity characteristics, enabling precise control of copper deposition in corresponding cathode regions to achieve uniform thickness across the foil surface.
Solution Approach 2:
Insulative masks are applied locally to specific regions of the anode where thickness variation occurs. This local modification of conductivity allows targeted control of deposition rates in problem areas without affecting other regions, achieving thickness uniformity while minimizing process complexity.
2Manufacturing precision
If insulative masks are applied to adjust plating time, then thickness uniformity is improved, but the device complexity increases
Solution Approach 1:
Insulative masks serve as intermediary elements between the power source and the anode surface. These masks selectively block electrical conductivity in specific regions, acting as mediators that control the distribution of current and consequently the copper deposition pattern to achieve uniform thickness.
Solution Approach 2:
Insulative masks are pre-applied to the anode surface before the electrodeposition process begins. This preliminary action of modifying the anode's conductivity distribution allows the system to automatically compensate for thickness variations during deposition without requiring real-time adjustments or complex control systems.
3Reliability
If copper foil with thickness variations is produced, then production efficiency is maintained, but product reliability deteriorates due to tears and wrinkles
Solution Approach 1:
The system incorporates feedback through the use of insulative masks that are positioned based on measured or predicted thickness variation patterns. By pre-positioning masks in regions where thickness variations occur, the system creates a feedback loop that automatically compensates for deposition non-uniformity, producing reliable foil without requiring post-production rejection or rework.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves a uniform thickness with a weight deviation of less than 2.0%, improved tensile strength of 30 kgf/mm2 to 40 kgf/mm2, and reduced surface roughness, enhancing the reliability and performance of the copper foil in electronic devices.
Implementation Method 1
applying direct current between these to allow copper to be electrodeposited on the cathode drum
Implementation Method 2
The one or more insulative masks are cut to correspond to the thickness profile so as to adjust the plating time and copper deposition
Data Source
AI summary
The present disclosure relates to an improved electrodeposited copper foil having uniform thickness and methods for manufacturing the electrodeposited copper foil. The electrodeposited copper foil typically has one to four interfacial lines through the cross-sectional area of the foil and a weight deviation less than 2.0%. The disclosure also relates to a process for making the electrodeposited copper foil that includes the addition of one or more insulative masks to the surface of a dimensionally stable anode. The insulative mask is cut to correspond to areas of variation in electrodeposited copper foil, such that the mask causes interferences with the electrodeposition process to even out the variation.