Low Profile PCB Extending Module for Third Connector Integration

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Solution Overview

Problem

Low profile external cards face challenges in accommodating a third connector due to design limitations, leading to increased manufacturing costs and potential signal interference from suspended cables over high-frequency circuits.

Innovation Solution

A low profile structure incorporating a PCB, bracket, and extending module with an extending PCB connected through leads, allowing the first connector to be mounted in the bracket and electrically connected to the PCB, reducing material usage and signal interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a third connector is added to a low profile external card using a Full High PCB design, then the connector accommodation capability is improved, but the manufacturing cost increases due to extra PCB material

Engineering Contradiction:
Improveconnector accommodation capabilityVSAvoidmanufacturing cost
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent divides the PCB into two separate components: a low profile PCB and an extending PCB. The low profile PCB maintains the original compact size for cost-effectiveness, while the extending PCB is added only where needed to provide the third connector. This segmentation allows the system to achieve enhanced connector accommodation capability without requiring a complete Full High PCB redesign, thus controlling manufacturing costs.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The extending PCB is designed to be electrically connected to and physically integrated with the low profile PCB, forming a nested structure. The extending PCB contains connectors that are electrically coupled to the low profile PCB through controlled impedance traces, creating a hierarchical arrangement where the extending functionality is embedded within the overall card structure without requiring a complete PCB replacement.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Shape

If a flat cable is used to connect the third connector to the PCB, then the low profile design is maintained, but signal interference occurs due to the cable suspending over high-frequency signal circuits

Engineering Contradiction:
Improvelow profile designVSAvoidsignal interference
Core Design Contradiction:
ShapeVSObject-affected harmful factors

Solution Approach 1:

The extending PCB serves as an intermediary structure between the low profile PCB and the third connector. Instead of using a flat cable that would suspend over high-frequency circuits and cause interference, the extending PCB provides a controlled impedance electrical connection path. This intermediary solution maintains the low profile shape while eliminating signal interference through proper trace routing and impedance control.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces the mechanical flat cable connection system with an electrical trace-based connection system on the extending PCB. This substitution eliminates the physical cable that would interfere with high-frequency signals, replacing it with controlled impedance traces that are integrated into the PCB structure, thereby maintaining signal integrity while preserving the low profile design.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If the extending PCB is electrically connected to the first connector through multiple leads, then the signal quality is improved, but the device complexity increases

Engineering Contradiction:
Improvesignal qualityVSAvoidconnection structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges multiple individual lead connections into an integrated trace system on the extending PCB. Instead of using separate discrete leads that would increase complexity, the electrical connections are routed through controlled impedance traces that are manufactured as part of the PCB itself. This merging approach maintains high signal quality through proper impedance control while reducing assembly complexity and improving manufacturing consistency.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS7445468B2Low profile structure
Publication Date: 2008.11.04 ASUSTEK COMPUTER INC
  • US7445468B2 patent drawing
  • US7445468B2 patent drawing
  • US7445468B2 patent drawing

AI summary

A low profile structure is disclosed. The structure includes a printed circuit board (PCB), a bracket, three connectors and an extending module, wherein the bracket is connected to the PCB to form the body of the low profile structure. In addition, one of the connectors is an extending connector and the other two connectors are configured on the bracket and are directly connected with PCB. The extending module further includes an extending PCB so that the extending PCB is electrically connected to the extending connector and the extending PCB is electrically connected to PCB. Therefore, the extending connector can be electrically connected to PCB via the extending PCB.