RFID Tag Insulator Nesting for Flat Surface Manufacturing
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Solution Overview
Problem
Conventional RFID tag manufacturing processes involve increased material usage and complex processes due to resin coating or film lamination, which can lead to gaps and reliability issues, especially when using high-frequency RFID tags, and there is a need for materials with both good electric properties and embedding characteristics.
Innovation Solution
The RFID tag features a memory medium surrounded by an insulator with a circuit exposed on one surface, and a manufacturing method where the insulator is fixedly adhered to a plate-like body before forming the circuit on the opposite surface, allowing for a thinner tag with simplified production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If the surface is coated with resin or laminated with a film to smoothen it, then the surface flatness is improved, but the manufacturing complexity and material usage increase
Solution Approach 1:
The insulator is formed to surround the memory medium before the circuit is created, establishing a flat surface foundation in advance. This preliminary structuring eliminates the need for subsequent surface flattening operations, as the insulator's geometry is designed to provide the required flatness from the outset.
2Shape
If the surface is laminated with a film for smoothening, then the surface flatness is improved, but gaps or voids may be caused between the component and the insulating substrate, lowering reliability
Solution Approach 1:
The memory medium is nested within the insulator, with the insulator forming a surrounding structure that completely encloses the component. This nesting arrangement eliminates gaps and voids between the component and insulating substrate, as the insulator is conformally formed around the memory medium, ensuring direct contact and reliable bonding.
3Reliability
If the antenna circuit is covered with an insulator, then the component is protected, but the insulator must have both good electric properties and embedding characteristic, requiring specific materials
Solution Approach 1:
The insulator is designed with different functional regions: one portion surrounds the memory medium to provide mechanical protection and electrical isolation, while another portion exposes the antenna circuit to maintain good electric properties for high-frequency operation. This local differentiation of insulator properties allows the use of conventional insulating materials without requiring specialized materials that simultaneously provide both protection and optimal electrical characteristics.
4Shape
If conventional manufacturing processes are used with resin coating or film lamination, then surface flattening is achieved, but the number of manufacturing processes increases
Solution Approach 1:
The formation of the insulator to surround the memory medium is combined with the circuit formation process in a single manufacturing sequence. The insulator is created as part of the substrate structure before the antenna circuit is deposited and patterned, merging what would traditionally be separate surface preparation and circuit fabrication steps into one integrated process flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a thinner RFID tag with simplified manufacturing and improved reliability by eliminating the need for surface flattening processes, while allowing for effective radio signal transmission and reception regardless of the insulator's electric characteristics.
Implementation Method 1
an insulator surrounding a memory medium
Implementation Method 2
a circuit for transmitting or receiving radio signals
Data Source
Figure 1
Figure 2
Figure 3
AI summary
An RFID tag includes an IC chip (14) for storing information, a thermoplastic resin (18) surrounding the chip (14) and circuit (12) for transmitting or receiving radio signals bearing the information. The antenna (12) is fixedly adhered on the thermoplastic resin (18) in a fashion being exposed on the surface of the thermoplastic resin (18). Accordingly, a manufacturing process may be used for covering the chip (14) mounted and bonded on the plate-like body (22) with the thermoplastic resin (18) to thereafter form the antenna circuit (12). It is thus possible to manufacture a thin RFID tag in a simplified process.