Cavity Semiconductor Packaging With Encapsulated Embedded Components
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Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to inadequate performance.
Innovation Solution
A semiconductor structure comprising a redistribution structure with a conductive structure, a cavity substrate, and an encapsulant, along with methods for manufacturing such structures, including the use of temporary bond layers and encapsulants to protect electronic components and facilitate electrical coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packages are used, then manufacturing cost is reduced, but reliability decreases and package size increases
Solution Approach 1:
The substrate is divided into active regions and inactive regions, with the inactive regions removed to create cavities. This segmentation allows the package to maintain structural integrity while reducing overall size and removing unnecessary material that would increase package volume.
Solution Approach 2:
Electronic components are placed within the cavities formed in the substrate, creating a nested structure where components are housed inside the substrate body rather than requiring additional external packaging space. This nesting approach reduces the overall package volume while maintaining component protection.
2Ease of manufacture
If conventional semiconductor packages are used, then manufacturing simplicity is maintained, but cost increases and performance decreases
Solution Approach 1:
Temporary bond layers are applied to the substrate before component assembly, and sacrificial materials are placed in cavities prior to final assembly. These preliminary actions enable simplified subsequent manufacturing steps while reducing the need for expensive post-assembly processing and material waste.
Solution Approach 2:
Sacrificial materials and temporary bond layers are used during manufacturing and then removed after serving their purpose. This approach enables complex structural features to be created through simpler processes, reducing manufacturing cost while maintaining ease of manufacture.
3Object-affected harmful factors
If conventional packages are used, then structural simplicity is maintained, but protection from external elements is insufficient
Solution Approach 1:
Encapsulants are applied as thin protective films over the electronic components and within the cavities, providing effective protection from environmental factors without requiring thick, bulky protective structures. This approach enhances protection while maintaining structural simplicity.
Solution Approach 2:
Encapsulants and protective coatings are applied in advance to protect electronic components from external elements before assembly is complete. This preemptive protection prevents damage during manufacturing and use without requiring complex protective mechanisms.
Data Source
AI summary
In one example, a semiconductor structure comprises a frontside substrate comprising a conductive structure, a backside substrate comprising a base substrate and a cavity substrate contacting the base substrate, wherein the backside substrate is over a top side of the frontside substrate and has a cavity and an internal interconnect contacting the frontside substrate, and a first electronic component over the top side of the frontside substrate and in the cavity. The first electronic component is coupled with the conductive structure, and an encapsulant is in the cavity and on the top side of the frontside substrate, contacting a lateral side of the first electronic component, a lateral side of the cavity, and a lateral side of the internal interconnect. Other examples and related methods are also disclosed herein.