Cavity Substrate Packaging for Multi-Die Thickness and Reliability

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Solution Overview

Problem

Current semiconductor packaging methods face challenges in efficiently arranging and connecting multiple semiconductor dies with varying sizes and dimensions, leading to complexities in manufacturing and integration with circuit substrates, which affects the reliability and performance of the final package.

Innovation Solution

A manufacturing method involving a redistribution layer with alternating dielectric and metallization layers, where semiconductor dies are bonded and encapsulated with a molding compound, and then connected to a circuit substrate with a cavity that accommodates additional dies, using underfills and reflow processes to ensure secure attachment and electrical connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple semiconductor dies with varying sizes and dimensions are arranged and connected in current packaging methods, then electrical connectivity and functionality are achieved, but manufacturing complexity increases and reliability decreases

Engineering Contradiction:

Improvearrangement of semiconductor dies with varying sizesVSAvoidmanufacturing complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The circuit substrate is divided into multiple cavities of different sizes and shapes, each designed to accommodate specific semiconductor dies. This segmentation allows each die to be placed in a customized cavity that fits its dimensions, simplifying the arrangement process while maintaining manufacturing feasibility.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Each cavity in the circuit substrate is designed with local quality tailored to the specific semiconductor die it accommodates. The cavities have varying sizes, shapes, and depths matched to the individual dies, enabling precise fitting and reducing manufacturing complexity compared to uniform packaging approaches.

Inventive Principle:

Principle #3Local quality

2Adaptability or versatility

Engineering Contradiction:

Improvearrangement of semiconductor dies with varying sizesVSAvoidreliability of final package

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

By segmenting the circuit substrate into multiple customized cavities, each semiconductor die is securely held in its own fitted space. This prevents movement and misalignment during operation, thereby improving the reliability of the final package while accommodating dies of varying sizes.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Semiconductor dies are nested within their respective cavities in the circuit substrate, with each die fitting into a custom-designed space. This nesting approach ensures stable positioning and reliable electrical connections, enhancing overall package reliability.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Reliability

If conventional packaging methods are used to connect semiconductor dies to circuit substrates, then electrical connectivity is achieved, but thickness of the package increases

Engineering Contradiction:

Improveelectrical connectivityVSAvoidthickness of package

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

Instead of placing semiconductor dies on the surface of the circuit substrate as in conventional methods, the dies are embedded into cavities within the substrate. This inverted approach reduces the overall package thickness while maintaining reliable electrical connectivity through the cavity structures.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The semiconductor dies are nested within the cavities of the circuit substrate, utilizing the internal space of the substrate rather than adding to its external dimensions. This nesting reduces package thickness while preserving electrical connectivity through the embedded configuration.

Inventive Principle:

Principle #7Nested doll (Nesting)

Data Source

PatentUS11908764B2Semiconductor package including a circuit substrate having a cavity and a floor plate embedded in a dielectric material and a semiconductor die disposed in the cavity

Publication Date: 2024.02.20 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least a circuit substrate, a semiconductor die and a filling material. The circuit substrate has a first surface, a second surface opposite to the first surface and a cavity concave from the first surface. The circuit substrate includes a dielectric material and a metal floor plate embedded in the dielectric material and located below the cavity. A location of the metal floor plate corresponds to a location of the cavity. The metal floor plate is electrically floating and isolated by the dielectric material. The semiconductor die is disposed in the cavity and electrically connected with the circuit substrate. The filling material is disposed between the semiconductor die and the circuit substrate. The filling material fills the cavity and encapsulates the semiconductor die to attach the semiconductor die and the circuit substrate.