Package Integration via Cavity Substrate for Stacked ICs
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges in improving integrated circuit package connectivity and stacking, leading to limited dimensional size, structural integrity, and manufacturing yield, due to restrictive manufacturing methods and poor connectivity between integrated circuits and packages.
Innovation Solution
A package substrate with a base package having a cavity formed through it, allowing for the attachment of devices and additional packages, enhancing connectivity and stacking capabilities by exposing a portion of the base package for further integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple integrated circuits are stacked within integrated circuit packages to reduce dimensional footprint, then area density is improved, but connectivity between components is compromised
Solution Approach 1:
The patent implements package-in-package stacking where a first integrated circuit package is positioned within a second integrated circuit package, creating a nested configuration. This nesting approach allows multiple packages to occupy the same footprint area while maintaining separate enclosures for each component, thereby preserving connectivity within each package while achieving high area density.
Solution Approach 2:
The patent transitions from two-dimensional lateral arrangement of packages to three-dimensional vertical stacking. By utilizing the vertical dimension (Z-axis) to stack packages one above another, the system achieves higher component density without compromising the connectivity of individual packages, as each package maintains its own enclosure and internal connections.
2Reliability
If additional space is provided for multiple components, then connectivity is improved, but size and complexity increase
Solution Approach 1:
By nesting the first package within the second package, the patent provides adequate space for multiple components and their connections without increasing the overall package dimensions. The nested configuration allows each package to maintain its own structural integrity and connectivity while sharing the same external footprint, thereby avoiding complexity increases.
Solution Approach 2:
The second integrated circuit package serves multiple functions: it provides structural enclosure for the first package, acts as a carrier for both packages, and maintains its own connectivity. This multi-functionality reduces the need for additional separate structures, thereby limiting complexity while providing adequate space for connectivity.
3Area of stationary object
If integrated circuits are stacked to improve dimensional density, then area utilization is improved, but structural integrity is compromised
Solution Approach 1:
The nested package configuration allows each package to maintain its own structural enclosure and integrity. The first package is enclosed within the second package, with each providing its own protective housing. This approach achieves high area utilization through vertical stacking while preserving the structural integrity of individual packages through their separate enclosures.
Solution Approach 2:
The patent divides the system into separate modular packages, each with its own structural enclosure. The first package and second package are distinct segments that can be manufactured and tested independently, then stacked together. This segmentation maintains the structural integrity of each component while achieving high area utilization through compact vertical arrangement.
Data Source
AI summary
An integrated circuit package system comprising: providing a package substrate; attaching a base package having a portion of the base package substantially exposed over the package substrate; forming a cavity through the package substrate to the base package; and attaching a device partially in the cavity and connected to the portion of the base package substantially exposed.