Cavity Wiring Substrate for Thin Embedded Component Interconnects
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Solution Overview
Problem
Existing wiring substrates with internal cavities for accommodating electronic components face challenges in efficiently connecting electrodes on both surfaces of the component to the substrate's conductive layers, often requiring complex via conductors and additional connecting parts, which can increase thickness and complexity.
Innovation Solution
A wiring substrate design featuring a first insulating layer, a conductive layer with exposed pads, a second insulating layer with a cavity that accommodates an electronic component with surface electrodes, and a conductive connecting part using anisotropic conductive films and granules to connect the electrodes to the pads, eliminating the need for cavity penetration through the core substrate and simplifying the connection process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex via conductors and additional connecting parts are used to connect electrodes on both surfaces of the component to the substrate's conductive layers, then electrical connection reliability is improved, but substrate thickness and device complexity increase
Solution Approach 1:
The patent utilizes the Z-dimension (vertical direction) by forming via conductors that penetrate through the insulating layer to connect the first and second conductive layers. This vertical connection approach resolves the contradiction by providing reliable electrical connection between electrodes on both surfaces while avoiding the need for complex lateral routing and additional connecting parts, thus reducing overall device complexity.
Solution Approach 2:
The patent embeds via conductors within the insulating layer structure, nesting the conductive connection paths inside the substrate layers rather than adding external connectors. This nested arrangement achieves reliable electrical connection while minimizing increases in substrate thickness and maintaining structural simplicity.
2Reliability
If complex via conductors and additional connecting parts are used to connect electrodes on both surfaces of the component to the substrate's conductive layers, then electrical connection reliability is improved, but manufacturing process complexity increases
Solution Approach 1:
The patent merges the functions of multiple separate connecting parts into a unified via conductor structure that simultaneously provides electrical connection between both surfaces. This consolidation simplifies the manufacturing process by reducing the number of discrete components and assembly steps required, while maintaining reliable electrical connection.
Solution Approach 2:
The via conductors serve multiple functions simultaneously: they provide electrical connection between the first and second conductive layers, act as structural support within the insulating layer, and enable mounting of electronic components. This multi-functionality reduces manufacturing complexity by eliminating the need for separate dedicated connecting parts.
3Adaptability or versatility
If the substrate structure is designed to accommodate electronic components with internal cavities, then component integration is improved, but substrate thickness increases
Solution Approach 1:
The patent employs thin insulating layers and conductive layer structures that provide necessary electrical isolation and connection while minimizing thickness. The flexible layer structure allows accommodation of electronic components within cavities without requiring excessive substrate thickness, thus improving component integration while controlling overall substrate thickness.
4Reliability
If conventional connecting methods are used to connect electrodes to pads, then electrical connection is achieved, but mounting temperature requirements increase
Solution Approach 1:
The patent changes the material parameters of the connecting structure by using conductive adhesives or solder materials with lower melting points in the via conductors and connecting parts. This parameter change allows electrical connection to be achieved at lower mounting temperatures, reducing thermal stress on sensitive electronic components while maintaining connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for efficient electrical connection of both surface electrodes of the electronic component to the substrate's circuits, reducing substrate thickness and simplifying the manufacturing process while preventing short circuits, and enabling lower-temperature mounting of components.
Implementation Method 1
a conductive connecting part formed between the electrodes of the electronic components and the pads of the first conductive layer in the cavity of the second insulating layer such that the conductive connecting part electrically connects the electrodes of the electronic components and the pads of the first conductive layer
Data Source
AI summary
A wiring substrate includes a first insulating layer, a first conductive layer laminated on a surface of the first insulating layer and including pads, a second insulating layer laminated on the first insulating layer such that the second insulating layer is covering the first conductive layer and has a cavity exposing the pads of the first conductive layer, an electronic component accommodated in the cavity of the second insulating layer such that the electronic component has electrodes formed on a surface of the electronic component, and a conductive connecting part formed between the electrodes of the electronic components and the pads of the first conductive layer in the cavity of the second insulating layer such that the conductive connecting part electrically connects the electrodes of the electronic components and the pads of the first conductive layer.