Cellulose-Modified Solder Paste for Reflow Scatter Suppression
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional solder materials fail to sufficiently suppress the scattering of flux and solder balls during the reflow process, leading to inefficiencies in electronic component bonding.
Innovation Solution
A solder material is developed containing a mixture of fibrous cellulose with lengths ranging from 1 μm to 1 mm and 1 nm to 1 μm, combined with a flux including a solvent, rosin-based resin, and an activator, which is mixed with a solder alloy to produce a paste that effectively reduces scattering during heating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional flux is used in solder material, then the solder material can be easily manufactured, but scattering of flux and solder balls cannot be sufficiently suppressed during heating
Solution Approach 1:
The patent introduces massive cellulose as an intermediary substance in the flux composition. The cellulose particles act as a mediator that absorbs and suppresses the scattering effect of gas bubbles generated during heating, thereby reducing the harmful scattering phenomenon while maintaining the flux's other functional properties
Solution Approach 2:
The patent changes the physical and chemical parameters of the flux by incorporating massive cellulose with specific properties (particle size, composition ratio of different cellulose components). This parameter modification enables the flux to suppress scattering during heating while maintaining ease of manufacture
2Object-affected harmful factors
If massive cellulose is added to suppress scattering, then scattering is sufficiently suppressed during heating, but the complexity of the flux composition increases
Solution Approach 1:
The patent creates a composite flux material by combining conventional flux components with massive cellulose. This composite approach allows the flux to maintain its original functional properties while adding the scattering-suppressing capability of cellulose, thereby managing complexity through a structured composite formulation
3Ease of operation
If conventional solder material is used, then the solder material can be easily applied, but scattering occurs during reflow heating
Solution Approach 1:
The massive cellulose acts as an intermediary that suppresses scattering during the heating process while maintaining the solder material's ease of application. The cellulose particles interfere with the movement and scattering of flux and solder balls without affecting the material's applicability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solder material significantly suppresses scattering during heating while maintaining proper meltability, making it suitable for electronic component bonding without impairing solder meltability.
Implementation Method 1
massive cellulose in which fibrous cellulose having a length of 1 μm or more and less than 1 mm and fibrous cellulose having a length of 1 nm or more and less than 1 μm are mixed
Data Source
AI summary
A method of producing a solder material is provided. The method includes mixing a flux containing a solvent, a rosin-based resin, and an activator, with aggregated cellulose. The aggregated cellulose includes massive cellulose in which fibrous cellulose having a length of from 1 μm or more to less than 1 mm, and fibrous cellulose having a length of from 1 nm or more to less than 1 μm. The resulting mixture is mixed with a solder alloy to produce a solder material.