Welding/Cutting Media/Materials TRIZ Cases

Gallium solder on Cu or Cu-Ni forms CuGa2 at 90°C or lower, creating flexible joints that keep conductivity under substrate deformation.

Spiral discharge grooves and a conical pin focus frictional heat, stabilize penetration, and improve joining of stacked steel or light-metal sheets.

Zirconium oxide powder suppresses flux reactions in solder paste, stabilizing viscosity over time and preserving printability during storage.

A non-uniform brazing gap with curved transitions, textures, ultrasound, and magnetic fields improves solder flow and clears bubbles and slag.

Local carbon addition in the butt joint gap stabilizes ULC steel laser weld pools, enabling higher speed and stronger seam geometry.

Solid-state welding creates selectively thicker clad regions on dissimilar metals, improving corrosion, friction, and heat management.

An intermediate layer blocks Mg diffusion into brazing filler, preserving post-brazing strength and joint brazing reliability.

A (2-carboxyalkyl)isocyanurate flux formulation improves solder wetting and cuts voids while staying stable across heating histories.

A rosin-based flux with isocyanurate adduct improves solder wet spreadability and cuts void generation across varying reflow heating histories.

A low-B flux-cored wire balances Mn, C, V, TiO2 and Nb to preserve weldability while improving PWHT toughness and SR crack resistance.

Cu layers with Al or Mg-containing Al joining layers keep Mg-Sb/Bi thermoelectric elements low in resistance while avoiding heat-driven decomposition.

A solid rosin methyl ester flux keeps solder wettability while preventing residue cracking and peeling in flux-cored and flux-coated solders.

A mixed-molecular-weight nonionic surfactant flux improves solder paste wettability, washability, and transferability while limiting Sn salt issues.

A tuned Al-Cu-Mn-Si strip composition and annealing route improve corrosion resistance while preserving strength and brazability in thinner heat exchangers.

A flux using 2-hydroxyisobutyric acid and mixed surfactants limits solder-joint voids while preserving wettability and reducing corrosion.

A multilayer silicon-carbon and amorphous silicon coating helps aluminum substrates resist corrosive fluids without crystallization or delamination.

Reflow soldering on masked connection pads lets smart card modules integrate lamination-sensitive components without added thickness or pad misalignment.

A Sn-Ag-Cu-Bi-In solder composition balances melting range, joint strength, and thin oxide films to suppress voids in step soldering.

A three-step slagging, gas refining, and directional solidification route cuts e-waste alloy impurities to 0.15% for stronger brazed joints.

An Al-Si-Mg-Sn brazing sheet suppresses MgO film growth, enabling stable flux-free aluminum bonding in open joints.

A PEG-based thixotropic balance keeps solder paste stable in storage, limits reflow burning, reduces voids, and enables easier cleaning.

Fractional crystallization concentrates silver from crude tin into a drain product that supports easier electrolysis and lower by-product volume.

Controlled TiN and CaS-forming chemistry keeps the high-heat-input weld HAZ fine-grained and tough at -55°C for tank and ship steel.

Balancing Ag, Cu, and Bi content lowers liquidus temperature while preserving mountability, joint strength, and thermal fatigue resistance.

A tuned Sn-Sb-Ag-Cu solder composition lowers cooling stress and voids while preserving heat dissipation and high-temperature joint strength.

Vanadium-modified nickel brazing alloy lowers brazing temperature while improving corrosion resistance in stainless steel engine heat exchangers.

A low-manganese tubular wire uses a deoxidizing granular core and controlled sheath chemistry to keep weld deposits tough while limiting manganese.

Simultaneous feeding of similar-composition and cobalt alloy fillers keeps repair-weld dilution in range to suppress cracking.

A three-layer aluminum brazing sheet uses an intermediate sacrificial layer to protect heat exchanger tubes after fin corrosion or detachment.

Solid-state welding creates thicker clad regions only where needed, improving corrosion and heat resistance while limiting costly material use.

Controlled free silicon and magnesium silicide improve aluminum weld fluidity and joint strength while limiting dilution and heat-affected zones.

A central groove concentrates heat at the weld edge, cutting current demand while reducing spatter, deformation, and electrode wear.

Composition limits for Nb, Mo, W, Ti, Si, and Al balance high-temperature strength, oxidation resistance, and weldability in ferritic stainless steel wire.

Moving the electrode along the thinner steel plate improves nugget merging and weld strength while limiting spatter in mixed-thickness spot welding.

Massive cellulose in solder paste suppresses flux and solder ball scattering during reflow while preserving meltability for component bonding.

A mixed melting and non-melting brazing alloy forms strong pore-free joints in plate heat exchangers while limiting base-metal erosion.

A tailored flux for 308L/309L electroslag strip cladding raises deposition rate while meeting nuclear overlay strength and ferrite limits.

An aluminum sheath strengthens fragile thermite rods, protects them in transport, and helps maintain burn continuity across breaks.

An oxygen-enriched Ti wire surface with metal-compound-filled cracks keeps MIG arcs stable in long welds without sacrificing weld ductility.

A Sn matrix with dispersed Ni-Fe alloy cuts voids and boosts shear strength in flux-free high-temperature solder joints.

Rosin methyl ester keeps flux solid-like at 25°C, preserving wettability while reducing residue cracking and peeling in cored and coated solders.

Mixed massive and fibrous cellulose tunes flux viscosity to suppress solder-joint voids across QFN, BGA, and CSP assemblies.

Alternative conductive and functional coatings replace copper to stabilize the arc, reduce contamination, and improve weld metal quality.

A three-layer Al brazing sheet uses Mg, Bi, and controlled melt flow to join heat exchangers in inert gas without flux or core erosion.

Solid solvents in solder flux cut residue and carbonization while maintaining viscosity, oxide removal, and soldering iron flow.

Integrally formed baffles and a rotating quick-connect lock improve suppressor alignment, gas control, durability, and noise reduction.

Controlled Mn, Ni, and Ni equivalent refine ferritic stainless weld metal through phase transformation, improving crack and corrosion resistance.

Ag-free Cu-Ti-Sn/In brazing with chemical polishing and acidic peroxide etching improves ceramic circuit board thermal cycle durability.

Balanced Sn-Bi-Sb-Cu-Ni solder composition lowers melting point while reducing brittleness, thermal fatigue, cracks, and interfacial peeling.

A carboxyalkyl isocyanurate flux improves solder wetting, removes oxides, and reduces reflow voids despite heating history variation.