Ceramic Wafer-Handling Arm With Antistatic Conductive Path
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Solution Overview
Problem
Ceramic blades used in robotic arms for wafer handling have low electrical conductivity, leading to charge accumulation and potential arcing during substrate processing, which can disrupt subsequent processes.
Innovation Solution
A robotic arm with a ceramic plate and antistatic coating layer, featuring multiple layers of conductive and elastic materials, including a conductive path to dissipate static charges, ensuring the substrate is transferred in a non-charged state.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a ceramic blade is used in the robotic arm, then flatness and vibration reduction are improved, but electrical conductivity deteriorates causing charge accumulation and arcing
Solution Approach 1:
The blade is constructed as a composite structure combining ceramic material with conductive materials. The ceramic portion provides flatness and vibration reduction, while the conductive material (such as metal coating or conductive adhesive) embedded in or on the ceramic provides the necessary electrical conductivity to prevent charge accumulation and arcing during substrate transfer.
2Stability of the object's composition
If a ceramic blade is used in the robotic arm, then vibrations are reduced, but electrical conductivity deteriorates leading to charge accumulation
Solution Approach 1:
The blade combines ceramic material for vibration reduction with conductive materials to ensure proper electrical conductivity. This composite approach allows the blade to maintain its structural stability and vibration-damping properties while simultaneously providing the electrical conductivity needed to prevent charge accumulation on substrates during transfer operations.
3Strength
If ceramic material is used for the blade, then structural integrity is improved, but electrical conductivity deteriorates causing arcing during processing
Solution Approach 1:
The blade is designed as a composite structure where ceramic material provides structural integrity and strength, while conductive materials (metal coatings, conductive adhesives, or embedded conductive elements) provide the necessary electrical conductivity. This prevents charge accumulation and subsequent arcing during substrate processing while maintaining the structural requirements for handling substrates.
Solution Approach 2:
A conductive intermediary material (such as metal coating or conductive adhesive) is introduced between the ceramic blade structure and the substrate. This intermediary layer maintains the structural benefits of ceramic while providing the electrical conductivity pathway needed to prevent charge accumulation and arcing during substrate transfer and processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents charge accumulation on substrates, allowing safe transfer and processing without arcing, while maintaining structural integrity and reducing vibrations.
Implementation Method 1
the arm body includes a ceramic plate and an antistatic coating layer disposed on an external surface of the ceramic plate... a conductive portion connecting the pad to the antistatic coating layer on an external side of the pad is provided
Implementation Method 2
the pad includes a first conductive layer... a conductive portion connecting the pad to the antistatic coating layer on an external side of the pad is provided
Implementation Method 3
a second layer disposed below the first layer and formed of a material having elasticity higher than that of the first layer
Data Source
AI summary
Provided is a robotic arm includes an arm body; and a plurality of pads connected to the arm body and in contact with a substrate, wherein the arm body includes a ceramic plate and an antistatic coating layer disposed on an external surface of the ceramic plate, wherein the pad includes a first conductive layer, and wherein a conductive portion connecting the pad to the antistatic coating layer on an external side of the pad is provided.


