Multilayer Ceramic Component Array With Interposer for Noise Attenuation
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Solution Overview
Problem
Multilayer ceramic electronic components generate acoustic noise due to piezoelectric phenomena, which can be propagated to substrates and perceived by humans, posing a challenge in reducing noise levels in IT devices.
Innovation Solution
A multilayer ceramic electronic component array is designed with a ceramic body having dielectric layers and internal electrodes, external electrodes connected to an interposer with an insulating body, and an additional insulating member between components, which reduces acoustic noise by attenuating and offsetting vibrations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multilayer ceramic electronic components are used to achieve small size and high capacity, then compactness and capacitance are improved, but acoustic noise is generated due to piezoelectric phenomena
Solution Approach 1:
An interposer with an insulating body is introduced between the multilayer ceramic electronic components and the substrate. This intermediary structure absorbs and attenuates vibrations generated by piezoelectric phenomena, preventing noise propagation to the substrate while maintaining the compact component arrangement.
Solution Approach 2:
The harmful vibration and noise are extracted from the component system by using the interposer to isolate and contain the piezoelectric effects within the component array, preventing their transmission to surrounding structures and substrates.
2Quantity of substance
If components are arranged in an array to increase capacity, then total capacitance is improved, but noise propagation to substrate increases
Solution Approach 1:
The interposer serves as a mediator between multiple high-capacitance components and the substrate, allowing the array configuration to achieve high total capacitance while the insulating body absorbs cumulative vibrations and prevents noise propagation to the substrate.
3Ease of manufacture
If external electrodes are connected directly to substrate to simplify mounting, then ease of mounting is improved, but noise is transmitted to substrate
Solution Approach 1:
The interposer with insulating body acts as an intermediary mounting structure that simplifies the connection process while simultaneously blocking noise transmission. The external electrodes connect to the interposer rather than directly to the substrate, maintaining ease of manufacture while preventing noise propagation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces acoustic noise and enhances fixing strength while maintaining high capacitance and reliability, as demonstrated by experimental data showing noise reduction and improved mounting stability.
Implementation Method 1
an insulating member disposed between adjacent ones of the plurality of multilayer ceramic electronic components and in contact with the ceramic body of each of the adjacent multilayer ceramic electronic components and being more flexible than the dielectric layer
Implementation Method 2
The multilayer ceramic electronic component may cause acoustic noise due to a piezoelectric phenomenon occurring therein
Data Source
AI summary
A multilayer ceramic electronic component array includes a plurality of multilayer ceramic electronic components including a ceramic body including a dielectric layer and first and second internal electrodes, and first and second external electrodes, respectively; and an interposer including an insulating body disposed below the plurality of multilayer ceramic electronic components, a first terminal electrode disposed on the insulating body and connected to at least a portion of the respective first external electrodes of the plurality of multilayer ceramic electronic components, and a second terminal electrode disposed on the insulating body and connected to at least a portion of the respective second external electrodes of the plurality of multilayer ceramic electronic components. The first external electrodes of the plurality of multilayer ceramic electronic components are in electrical contact with each other, and the second external electrodes of the plurality of multilayer ceramic electronic components are in electrical contact with each other.