Ceramic circuit board, semiconductor device, and method for using semiconductor device
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Solution Overview
Problem
Existing ceramic circuit boards for semiconductor elements face challenges in efficiently dissipating heat while maintaining a compact size, as conventional methods either increase the size of the heat sink or raise costs due to three-dimensional shaping, and they often require additional components like heat sinks and thermal interface materials.
Innovation Solution
A ceramic circuit board design featuring a ceramic substrate with a cooling passage metal plate bonded to both surfaces, where the ceramic substrate thickness is less than the metal plate thickness, allowing for reduced component count and improved heat dissipation through a carefully optimized thickness ratio and active metal brazing for strong bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a separate heat sink is added to improve cooling efficiency, then heat dissipation performance is improved, but device size and component count increase
Solution Approach 1:
The patent merges the heat dissipation function into the circuit board itself by integrating a cooling passage metal plate with water passages directly into the board structure. This eliminates the need for separate heat sink components while maintaining effective heat dissipation from semiconductor elements through the integrated cooling channels.
Solution Approach 2:
The circuit board is designed to perform multiple functions simultaneously: it provides electrical connectivity through circuit patterns, structural support through the ceramic substrate, and heat dissipation through the integrated cooling passage metal plate with water passages. This multi-functionality reduces the overall component count while achieving effective cooling.
2Temperature
If three-dimensional shaping of ceramic substrate is performed to improve cooling, then cooling efficiency is improved, but manufacturing cost increases
Solution Approach 1:
The patent divides the cooling structure into separate functional layers: a flat ceramic substrate for electrical connectivity and a separate cooling passage metal plate with water passages bonded to its surface. This segmentation allows each component to be manufactured using standard flat manufacturing processes, avoiding costly three-dimensional shaping of the ceramic substrate while still achieving effective cooling through the integrated structure.
3Temperature
If additional thermal interface materials are used to improve heat transfer, then heat dissipation is improved, but device complexity and assembly steps increase
Solution Approach 1:
The patent uses a bonding layer composed of active metal brazing material that serves dual functions: it provides strong mechanical bonding between the ceramic substrate and cooling passage metal plate, and simultaneously acts as a thermal interface material to conduct heat efficiently from the semiconductor elements through the ceramic substrate to the cooling passages. This eliminates the need for separate thermal grease or interface materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation efficiency, reduces the number of components, and allows for a more compact form factor without the need for additional heat sinks or thermal greases, while maintaining structural integrity and productivity.
Implementation Method 1
a cooling passage metal plate (4) including a cooling passage portion (5)... circulating the cooling medium in the cooling passage portion (5)... heat dissipation through a carefully optimized thickness ratio
Implementation Method 2
active metal brazing for strong bonding
Data Source
AI summary
A ceramic circuit board according to the embodiment includes: a ceramic substrate; and metal plates each bonded to both surfaces of the ceramic substrate. The metal plate bonded to at least one of both the surfaces of the ceramic substrate is a cooling passage metal plate including a cooling passage portion. The ceramic substrate preferably has a thickness smaller than a thickness of the cooling passage metal plate. The ceramic substrate preferably includes a first ceramic substrate and a second ceramic substrate bonded to the metal plate bonded to the first ceramic substrate, one of surfaces of the second ceramic substrate being bonded to the cooling passage metal plate bonded to the first ceramic substrate, and a metal plate being bonded to another of the surfaces of the second ceramic substrate.