Mirror-symmetrical periodic conductors with dual voltages suppress hot carrier light emission and inductive noise in image sensor boards.
Integrated cooling passages in a bonded metal plate improve semiconductor heat removal while cutting heat sinks, grease, and board bulk.
A stepped cushion plate with a PET support layer reduces bezel width while limiting adhesion unevenness and visible pressed stains.
A PCB RF transmitter, receiver, and waveguide carry surgical image data across an isolation barrier above 1 Gbps while avoiding capacitive discharge.
A supporting part between the bent and curved OLED sections prevents dislocation, holds bending angle, and improves manufacturing accuracy.
Protruding FPC coverlays reinforce signal and ground wiring while keeping pads solderable to reduce disconnection and high-frequency reflection.
By bonding dies onto a foldable flexible circuit board before stacking, this 3D package cuts process complexity, cost, and yield loss.