Folded Flexible Circuit Board 3D Packaging With Pre-Bonded Dies
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Solution Overview
Problem
Current 3D package configurations are complex, time-consuming, and costly due to processes like thin film deposition, photolithography, and etching, with low yield rates, necessitating a simpler and more efficient manufacturing method.
Innovation Solution
A 3D package configuration utilizing a folded flexible circuit board stacked on a package substrate with semiconductor dies bonded through die bonding zones, allowing for vertical stacking and electrical connection using conventional techniques, with materials like Polyester resin and copper for the substrate and circuit, respectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional 3D package configurations use thin film deposition, photolithography, and etching processes, then interconnection and integration are achieved, but manufacturing complexity increases and production time is extended
Solution Approach 1:
The patent extracts and eliminates the complex thin film deposition, photolithography, and etching processes from the 3D packaging manufacturing flow. Instead, it uses direct die-to-substrate bonding with pre-formed interconnect structures, removing unnecessary manufacturing steps while maintaining electrical interconnection reliability between stacked dies and substrate
Solution Approach 2:
The patent inverts the conventional approach by bonding dies directly to the substrate first, then forming interconnect structures afterward, rather than creating complex interconnect layers before die attachment. This reversal simplifies the manufacturing sequence while achieving the same interconnection function
2Reliability
If conventional 3D package configurations use multiple semiconductor fabrication processes, then electrical interconnection is achieved, but production time increases and yield rate decreases
Solution Approach 1:
The patent applies preliminary action by pre-forming the interconnect structures and bonding pads on the substrate before die attachment. This allows subsequent die bonding and interconnection to proceed rapidly without requiring in-situ fabrication processes, thereby increasing production speed and yield while maintaining reliable electrical interconnection
3Adaptability or versatility
If conventional 3D package configurations use complex fabrication processes, then integration is achieved, but manufacturing cost increases
Solution Approach 1:
The patent applies universality by using a standardized die bonding process that can accommodate multiple die types and configurations on the same substrate. The simplified manufacturing approach maintains integration capability across different application scenarios while reducing dependency on expensive, specialized fabrication processes
Data Source
AI summary
A novel 3D package configuration is provided by stacking a folded flexible circuit board structure on a package substrate and electrically connected therewith based on the foldable characteristics of the flexible circuit board, and the high temperature resistance of the flexible circuit board which is suitable for insulating layer process, metal layer process, photolithography process, etching and development process, to make conventional semiconductor dies of various functions be bonded on one die and/or two side of a flexible circuit board and electrically connected therewith in advance.