Ceramic Capacitor Electrode Composition for Thin-Layer Continuity
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Solution Overview
Problem
Existing ceramic electronic components face challenges in maintaining internal electrode layer continuity when thickness is reduced, leading to potential fractures and decreased capacitance due to thermal impact, and the use of noble metals increases production costs and resource depletion.
Innovation Solution
Incorporating Al, Cr, and Fe, or Si into the internal electrode layers, with segregation at dielectric layer interfaces and grain boundaries, enhances continuity and reduces reliance on rare metals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of the internal electrode layer is decreased to miniaturize the ceramic electronic component, then the capacitance value per layer increases, but fracture is likely to occur due to thermal impact during firing and continuity of the internal electrode layer decreases
Solution Approach 1:
The patent changes the compositional parameters of the internal electrode layer by incorporating specific elements (Ni, Cu, Zn, Co, Mn, Al, Cr, Fe, Si, B) in controlled amounts. This compositional modification prevents grain growth during firing and reduces thermal stress, allowing thin electrode layers to maintain continuity without fracture while enabling component miniaturization
Solution Approach 2:
The patent creates a composite internal electrode layer by combining multiple metal elements (typically Ni as base metal with at least one of Cu, Zn, Co, Mn, Al, Cr, Fe, Si, or B). This composite structure leverages the beneficial properties of each element to prevent grain growth, reduce thermal stress, and maintain layer continuity during the firing process, solving the contradiction between miniaturization and reliability
2Reliability
If all noble metals are used in the internal electrode layers to prevent grain growth and maintain continuity, then the continuity of internal electrode layers is improved, but the cost of products increases and rare metals are depleted
Solution Approach 1:
The patent replaces expensive and scarce noble metals with abundant, cost-effective base metals (Ni, Cu, Zn, Co, Mn, Al, Cr, Fe, Si, B). These alternative materials provide the necessary grain growth inhibition and thermal stress reduction functions without the high cost and scarcity concerns of noble metals, making the ceramic electronic components more economically viable and sustainable
Solution Approach 2:
The patent modifies the material composition parameters by selecting specific base metals and controlling their content ratios. This compositional optimization achieves the desired grain growth control and continuity maintenance functions previously requiring noble metals, but using abundant, inexpensive materials to reduce both cost and rare metal dependency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a ceramic electronic component with improved internal electrode continuity, reduced production costs, and sustainability by avoiding rare metals while maintaining excellent process stability.
Implementation Method 1
at least one selected from the group consisting of Al, Cr, Fe, and Si is precipitated in the internal electrode layers
Implementation Method 2
a capacitive part in which a plurality of dielectric layers containing a ceramic as a main component and a plurality of internal electrode layers are alternately laminated on each other
Data Source
AI summary
A ceramic electronic component according to an embodiment of the present invention includes an element body including a capacitive part in which a plurality of dielectric layers containing a ceramic as a main component and a plurality of internal electrode layers are laminated on each other. All elements of Al or Cr, Fe, and Si are present in the capacitive part, and at least one of these elements is precipitated in the internal electrode layers.