Multilayer Ceramic Capacitor End Geometry for Stable Electrode Strength

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Solution Overview

Problem

Lower-profile multilayer ceramic electronic components face challenges in maintaining mechanical strength due to varying film formation properties and thicknesses of external electrodes on different surfaces, leading to inconsistent mechanical strength and increased costs.

Innovation Solution

A multilayer ceramic electronic component design with a trapezoidal shape, where the relationship B<A is satisfied, and angles θ1 and θ2 are between 10° and 50°, allowing for uniform external electrode formation on both main and end surfaces using ink jet or sputtering, ensuring stable mechanical strength and easy soldering during mounting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If different methods are used to form external electrodes on opposite main surfaces and opposite end surfaces of the ceramic body, then film formation properties and thickness of external electrodes are improved, but manufacturing precision and consistency of plating film thickness deteriorate

Engineering Contradiction:

Improvefilm formation propertiesVSAvoidthickness of plating film

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies homogeneity by using the same inkjet method to form external electrodes on both opposite main surfaces and opposite end surfaces of the ceramic body. This ensures uniform film formation properties and consistent thickness across all surfaces, eliminating the variability introduced by using different formation methods for different surfaces.

Inventive Principle:

Principle #33Homogeneity

2Reliability

If the thickness of plating film is increased to improve film formation properties, then reliability of external electrodes is improved, but the thickness of ceramic body must be reduced further to meet dimensional standards, leading to decreased mechanical strength

Engineering Contradiction:

Improvefilm formation propertiesVSAvoidmechanical strength

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent changes the parameter of plating film thickness to a controlled range of 5 μm to 20 μm, which is optimized to provide sufficient reliability and film formation properties without requiring excessive thickness that would necessitate reducing the ceramic body thickness and compromising mechanical strength.

Inventive Principle:

Principle #35Parameter changes

3Adaptability or versatility

If the ceramic body thickness is reduced to meet dimensional standards with thicker plating film, then adaptability to dimensional constraints is improved, but mechanical strength of the multilayer ceramic electronic component deteriorates

Engineering Contradiction:

Improvedimensional standards complianceVSAvoidmechanical strength

Core Design Contradiction:

Adaptability or versatilityVSStrength

Solution Approach 1:

The patent optimizes the plating film thickness parameter to 5 μm to 20 μm, which allows the ceramic body to maintain sufficient thickness for mechanical strength while still meeting dimensional standards. This parameter optimization resolves the conflict between dimensional compliance and mechanical strength.

Inventive Principle:

Principle #35Parameter changes

4Ease of manufacture

If different methods are used for forming external electrodes on different surfaces, then ease of electrode formation is improved, but device complexity and manufacturing cost increase

Engineering Contradiction:

Improveexternal electrode formationVSAvoidmanufacturing process

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent applies universality by using the inkjet method for forming external electrodes on all surfaces of the ceramic body, including both opposite main surfaces and opposite end surfaces. This single versatile method eliminates the need for multiple different formation processes, thereby reducing manufacturing process complexity and cost.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design achieves stable mechanical strength, facilitates high-quality mounting, and reduces the thickness of the multilayer body within dimensional standards, enhancing reliability and moisture resistance.

Implementation Method 1

allowing for uniform external electrode formation on both main and end surfaces using ink jet or sputtering

Methodology Applied

Scientific EffectInk jet deposition:

Implementation Method 2

allowing for uniform external electrode formation on both main and end surfaces using ink jet or sputtering

Methodology Applied

Scientific EffectSputtering: Sputtering

Data Source

PatentUS11791102B2Multilayer ceramic electronic component and mount structure for multilayer ceramic electronic component

Publication Date: 2023.10.17 MURATA MFG CO LTD

AI summary

A multilayer ceramic capacitor has a relationship of about 10°≤θ1≤about 50° and a relationship of about 10°≤θ2≤about 50°, where θ1 denotes an angle between a first end surface and a perpendicular extending from a side of a first main surface at a point of intersection of the first main surface and the first end surface, and θ2 denotes an angle between a second end surface and a perpendicular extending from a side of the first main surface at a point of intersection of the first main surface and the second end surface.