Laminated Ceramic Capacitor High-Void Core Stress Buffering

The patent applies local quality by creating a ceramic green sheet with non-uniform binder distribution, where the binder concentration varies through the thickness direction. Specifically, the binder content is higher in the central region compared to the surface regions, creating a gradient structure that generates controlled voids during sintering. This local variation in binder quality allows the central portion to act as a stress buffer while maintaining overall structural integrity, directly resolving the contradiction between reliability and structural complexity.

The patent utilizes porous materials by intentionally creating a void phase within the ceramic body through non-uniform binder distribution. The voids, formed where binder disappears during sintering, create a porous structure in the central region that serves as a stress buffer. This porous architecture absorbs and diffuses thermal stress, preventing crack propagation while maintaining the external dimensional integrity of the ceramic component.

The patent resolves this contradiction by applying local quality through spatially selective binder distribution. Instead of uniformly increasing binder content throughout the entire ceramic green sheet, the binder is concentrated specifically in the central region while maintaining lower content at the surfaces. This localized approach provides stress buffering capacity exactly where thermal stress concentrates (in the interior) without compromising the structural strength and dimensional stability provided by the surface regions.

The patent applies parameter changes by varying the binder concentration parameter through the thickness direction of the ceramic green sheet. The binder content parameter transitions from lower values at the surfaces to higher values in the central region, creating a gradient structure. This parameter variation allows optimization of both stress buffering (via higher binder in center) and structural strength (via lower binder at surfaces), resolving the contradiction between these two properties.

The patent applies blessing in disguise by converting the potentially harmful effect of binder disappearance during sintering into a beneficial stress-buffering void structure. Instead of preventing binder removal (which would maintain simplicity but create stress concentration), the invention strategically places binder in the central region where its disappearance creates voids that absorb and diffuse stress. This transforms the harmful stress concentration effect into a beneficial stress diffusion mechanism, reducing crack risk while maintaining manufacturing simplicity.

The patent uses local quality to prevent harmful stress transmission by creating a localized void structure in the central region. This localized porosity acts as a stress buffer that intercepts and diffuses thermal stress before it can propagate through the entire ceramic body. The surface regions maintain dense, strong structure for structural integrity, while the central porous region absorbs stress, thereby reducing overall stress transmission without complicating the manufacturing process.