Laser lowers resistance only where electrodes are needed, enabling selective catalytic adhesion and electroless plating on ceramic parts.
Blended dielectric fillers in a polymer matrix keep voltage-divider capacitance within ±0.5% across temperature while withstanding at least 50 kV.
A surface modifier enables selective coating on ceramic or glass areas while keeping electrodes uncoated for conductivity and mass production.
Controlled Sn and rare-earth doping suppresses dielectric grain growth, helping multilayer capacitors keep high capacitance and withstand voltage.
A homogeneous Ba(Ti(1-2x)RxWx)O3 ceramic composition cuts DC bias attenuation and keeps capacitance stable above 200°C.
Protruding insulating-layer sections use surface tension to draw underfill through tight mounting gaps without enlarging the component footprint.
A higher-k dielectric beside the electrode redistributes electric fields in a digital isolator, improving breakdown resistance without thicker insulation.
A solid-solution dielectric creates polar nanoregions to retain permittivity under high electric fields, enabling smaller, thinner capacitors.
Plate-like cycloolefin domains in a polyolefin matrix improve gas barrier, dielectric insulation, and film stability in thin oriented films.
A quartz-Al2O3-ZrO2 filled glass-ceramic enables low-temperature sintering while balancing dielectric loss, strength, and thermal expansion.