Electronic Component Insulating Layer Layout for Underfill Penetration
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Solution Overview
Problem
Existing electronic components mounted upside down on a motherboard face challenges in underfill penetration when the gap between the motherboard and the component is small, making it difficult for the underfill to enter and secure the component effectively.
Innovation Solution
The electronic component features a substrate with alternately stacked conductor and insulating layers, and an insulating layer in the uppermost position with protruding parts that facilitate underfill penetration due to surface tension, allowing the underfill to easily spread across the gap between the motherboard and the component without increasing the component's size or interfering with terminal electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the gap between the motherboard and electronic component is small, then the mounting density is improved, but the underfill penetration becomes difficult
Solution Approach 1:
The insulating layer is extended in the planar direction to form protruding parts that protrude from the side surfaces of the substrate. This dimensional extension creates additional access points for underfill to penetrate into the gap between the electronic component and motherboard, solving the penetration difficulty caused by small gaps while maintaining high mounting density.
2Ease of operation
If the protruding part is added to the insulating layer, then the underfill penetration is facilitated, but the planar size of the electronic component increases
Solution Approach 1:
The protruding parts are formed by locally extending the insulating layer at specific positions on the side surfaces of the substrate, rather than uniformly increasing the overall size. This localized modification facilitates underfill penetration at critical areas while minimizing the increase in the electronic component's planar dimensions.
3Ease of manufacture
If the insulating layer is shrunk during manufacturing, then the manufacturing process is simplified, but electrical disconnection occurs
Solution Approach 1:
The bridge part is formed by extending the insulating layer to connect adjacent electronic components before the shrinking process occurs. This pre-formed connection structure acts as a cushion that prevents electrical disconnection even when the insulating layer shrinks during subsequent manufacturing processes, ensuring manufacturing reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures smooth penetration of underfill even in small gaps, enhancing mounting reliability and preventing electrical disconnection due to insulating layer shrinkage, while maintaining the component's size and functionality.
Implementation Method 1
the underfill supplied after the electronic component is mounted upside down on a motherboard penetrates into a gap between the motherboard and the electronic component due to surface tension originating from the protruding part
Data Source
AI summary
Disclosed herein is an electronic component that includes a substrate, a functional layer formed on the substrate and having a plurality of alternately stacked conductor layers and insulating layers, and a plurality of terminal electrodes provided on an uppermost one of the insulating layers. The uppermost one of the insulating layers has a substantially rectangular planar shape and has a protruding part protruding in a planar direction from at least one side in a plan view.