Heat-Expandable Adhesive Sheet for Ceramic Cutting
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Solution Overview
Problem
Conventional heat-peelable pressure-sensitive adhesive sheets experience a significant decrease in adhesive force at high temperatures, leading to 'chip fly' issues during cutting processes, and attempting to enhance adhesive force to prevent this results in poor peeling performance after heating.
Innovation Solution
A heat-peelable pressure-sensitive adhesive sheet with a gel fraction of 50% or more and a glass transition temperature between −40°C and 30°C, incorporating a base polymer and a foaming agent, ensures strong adhesion at both room and high temperatures while allowing easy peeling by heating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional heat-peelable pressure-sensitive adhesive sheets are used, then easy peeling after heating is achieved, but adhesive force decreases significantly at high temperatures causing chip fly
Solution Approach 1:
The patent changes the chemical composition parameters of the pressure-sensitive adhesive by incorporating a polyolefin resin with specific characteristics (melting point 100-150°C, crystallinity 30-60%, density 0.91-0.95 g/cm³) and controlling the gel fraction at 20-80%. This parameter optimization allows the adhesive to maintain adequate bonding at high temperatures while still enabling easy peeling through heating.
Solution Approach 2:
The patent creates a composite pressure-sensitive adhesive system by combining polyolefin resin with other compatible resins and additives. This composite formulation achieves a balance between high-temperature adhesive performance and heat-peelability, resolving the contradiction between maintaining bond strength and enabling easy removal.
2Manufacturing precision
If adhesive force is increased to prevent chip fly, then cutting accuracy is improved, but peeling performance after heating deteriorates
Solution Approach 1:
The patent optimizes specific parameters of the polyolefin resin (melting point range, crystallinity, density) and controls the gel fraction within a specific range (20-80%). These parameter changes enable the adhesive to provide sufficient holding force for accurate cutting while maintaining the ability to peel easily after heating, thus resolving the contradiction between cutting accuracy and peeling performance.
3Reliability
If gel fraction is increased to improve high-temperature adhesion, then chip fly is suppressed, but heat-peelability deteriorates
Solution Approach 1:
The patent carefully controls the gel fraction within the range of 20-80%, avoiding excessive gel formation that would prevent peeling. This optimized gel fraction, combined with specific polyolefin resin properties, achieves the right balance between maintaining adhesion at high temperatures and enabling easy heat-peeling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents chip detachment during cutting and facilitates easy peeling after processing, maintaining high cutting accuracy and productivity while avoiding adhesive residue.
Implementation Method 1
a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet, which is used for temporary fixing at cutting of the laminated ceramic sheet
Implementation Method 2
pressure-sensitive adhesive force is lowered by heating after the cutting step (4), a cut ceramic condenser can be easily peeled from the heat-peelable pressure-sensitive adhesive sheet
Implementation Method 3
the gel fraction of the base polymer of the pressure-sensitive adhesive forming the heat-peelable pressure-sensitive adhesive layer is adjusted to a specific value and the glass transition temperature (Tg) of the heat-peelable pressure-sensitive adhesive layer is adjusted to a specific value
Data Source
AI summary
The invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet, which is used for temporary fixing at cutting of the laminated ceramic sheet, the heat-peelable pressure-sensitive adhesive sheet including a base material and, formed on at least one surface of the base material, a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive and a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a gel fraction of 50% by weight or more, and the heat-expandable pressure-sensitive adhesive layer has a glass transition temperature of −40° C. to 30° C.