Wiring Board With Three Terminal Electrodes for ESR ESL Control

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Solution Overview

Problem

Existing wiring boards with built-in electronic components face challenges in efficiently managing Equivalent Series Resistance (ESR) and Equivalent Series Inductance (ESL), leading to power loss and noise issues due to the bipolar structure of terminal electrodes.

Innovation Solution

A wiring board design featuring a substrate with a cavity, a multilayer ceramic capacitor (MLCC) with three metal film-like terminal electrodes of opposite polarities, and via conductors connecting these electrodes in a parallel array, allowing for flexible connection configurations to optimize ESR and ESL positioning.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a bipolar structure with two terminal electrodes is used, then the device complexity is reduced, but the ESR and ESL management becomes inefficient leading to power loss and noise issues

Engineering Contradiction:

Improveterminal electrode structureVSAvoidpower loss

Core Design Contradiction:

Device complexityVSLoss of energy

Solution Approach 1:

The terminal electrode structure is segmented from two bipolar electrodes into three unipolar electrodes (first terminal electrode, second terminal electrode, and third terminal electrode). This segmentation allows independent optimization of current paths, enabling separate control of ESR and ESL characteristics to reduce power loss and noise.

Inventive Principle:

Principle #1Segmentation

2Ease of manufacture

If a bipolar structure with two terminal electrodes is used, then the manufacturing process is simplified, but noise issues occur due to inefficient ESR and ESL management

Engineering Contradiction:

Improveterminal electrode structureVSAvoidnoise

Core Design Contradiction:

Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

Inventive Principle:

Principle #1Segmentation

3Adaptability or versatility

If three terminal electrodes with metal film form are used in parallel array, then ESR and ESL positioning flexibility is improved, but the device complexity increases

Engineering Contradiction:

ImproveESR and ESL positioning flexibilityVSAvoidterminal electrode structure

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

Different regions of the terminal electrode structure are assigned different functions: the first and second terminal electrodes are configured to control ESR characteristics, while the third terminal electrode controls ESL characteristics. This local quality differentiation enables independent optimization of each electrode's function to achieve flexible ESR and ESL positioning.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The terminal electrodes are arranged in a parallel array configuration with specific spatial relationships: the first and second terminal electrodes are positioned adjacent to each other, while the third terminal electrode is positioned at a different location. This spatial arrangement in multiple dimensions enables independent control of ESR and ESL paths.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

4Reliability

If via conductors are formed to connect conductor layer and three terminal electrodes, then connectivity and performance are enhanced, but the manufacturing precision requirements increase

Engineering Contradiction:

ImproveconnectivityVSAvoidvia conductor positioning

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The via conductors are formed to connect the conductor layer and the three terminal electrodes before final assembly, establishing reliable electrical connections in advance. This preliminary action ensures that the ESR and ESL optimization paths are properly established before the device is put into operation.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS9930791B2Wiring board with built-in electronic component and method for manufacturing the same

Publication Date: 2018.03.27 IBIDEN CO LTD

AI summary

A wiring board with a built-in electronic component includes a substrate having a cavity, an interlayer insulating layer formed on the substrate such that the interlayer insulating layer is covering the cavity of the substrate, a conductor layer formed on the interlayer insulating layer, an electronic component accommodated in the cavity of the substrate and including a rectangular cuboid body and three terminal electrodes such that each of the three terminal electrodes has a metal film form formed on an outer surface of the rectangular cuboid body, and via conductors formed in the interlayer insulating layer such that the via conductors are connecting the conductor layer and the three terminal electrodes of the electronic component. The three terminal electrodes are arrayed in parallel on the outer surface of the rectangular cuboid body such that adjacent terminal electrodes have the opposite polarities.