Structural Capacitor Layer Alignment via Intermediary Pins
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Solution Overview
Problem
Existing methods for creating laminated structural capacitors are limited to a few layers due to lateral movement and misalignment of materials during bonding, which affects structural strength, capacitance, and energy storage capacity.
Innovation Solution
The use of planar structural dielectric layers with alignment holes and corresponding alignment pins to maintain layer alignment, allowing for the stacking and bonding of multiple layers without lateral shifting, along with electrodes having specific alignment holes for precise positioning and electrical contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional methods (evacuated bag, autoclave, hot press) are used to bond laminated capacitor layers, then the layers can be bonded together, but the layers move laterally and lose alignment under compaction pressure
Solution Approach 1:
Alignment holes are pre-formed in each dielectric layer and electrode at the correct positions before bonding. These pre-formed features guide the assembly process and ensure proper alignment is established before compaction pressure is applied, preventing lateral movement during bonding.
Solution Approach 2:
Alignment pins are introduced as intermediary elements that fit through the alignment holes in multiple layers simultaneously. These pins act as mechanical mediators that maintain precise relative positioning of all layers during the bonding process, preventing lateral shifting while allowing the layers to be bonded together.
2Quantity of substance
If more layers are stacked to increase capacitance and energy storage, then the structural strength and energy capacity improve, but lateral movement and misalignment become more severe
Solution Approach 1:
Each layer is pre-prepared with alignment holes at the correct positions before assembly. This preliminary action ensures that when multiple layers are stacked, the alignment features are already in place to guide proper positioning, making it feasible to stack many layers while maintaining alignment.
Solution Approach 2:
Alignment pins serve as intermediary elements that extend through multiple layers simultaneously, providing continuous alignment reference across the entire stack. This allows a large number of layers to be assembled and bonded while maintaining precise alignment throughout the thick laminate structure.
3Manufacturing precision
If alignment features are added to maintain layer positioning, then manufacturing precision improves, but device complexity increases
Solution Approach 1:
The alignment holes serve multiple functions: they guide the insertion of alignment pins during assembly, provide mechanical registration features for precise positioning, and act as pathways for electrical conductors. This multi-functionality reduces the need for separate alignment features, minimizing added complexity.
Solution Approach 2:
The alignment features (holes and pins) are integrated into the existing capacitor structure rather than being added as separate components. The alignment holes are formed as part of the dielectric layers, and the alignment pins are incorporated into the overall assembly process, merging the alignment function with the structural and electrical functions of the capacitor.
Data Source
AI summary
A structural capacitor having a plurality of planar dielectric layers and a plurality of positive and negative electrodes with the positive and negative electrodes alternating between each dielectric layer and methods for making structural capacitors are provided. First and second spaced apart holes are provided through each dielectric layer as well as the electrodes so that the first holes in the electrodes register with the first holes in the dielectric layer and likewise for the second holes. The capacitor is formed by stacking the dielectric layers and electrodes on two spaced apart alignment pins with a positive alignment pin extending through the first holes and a negative alignment pin extending through the second holes in the dielectric layers and electrodes. These alignment pins maintain layer alignment during subsequent thermal and pressure processing to bond together the dielectric and electrode layers into an integral structural material. After processing, the alignment pins are removed and replaced with electrode pins, where the positive electrode pin is in electrical contact only with the positive electrodes and the negative electrode pin is in electrical contact only with the negative electrodes. The electrode pins are used for subsequent electrical and mechanical connectorization to the structural capacitor.