Digital Isolator Dielectric Layout for Breakdown Resistance

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Solution Overview

Problem

Digital isolators face challenges in increasing resistance to dielectric breakdown, particularly due to electric field concentration, which can lead to potential dielectric breakdown risks without increasing the thickness of the insulating parts or the manufacturing costs associated with substrate warping.

Innovation Solution

The digital isolator design incorporates dielectric parts with higher relative dielectric constants strategically positioned between electrodes and insulating parts, distributing electric field lines and reducing concentration, thereby enhancing resistance to dielectric breakdown without increasing the thickness of the insulating parts or the chip area.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the thickness of the insulating part is increased to reduce electric field concentration, then the resistance to dielectric breakdown is improved, but the manufacturing cost increases due to substrate warping

Engineering Contradiction:
Improveresistance to dielectric breakdownVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent introduces a dielectric part with higher relative dielectric constant than the insulating part, positioned adjacent to the first electrode. This creates local variation in dielectric properties to redistribute the electric field concentration specifically at the critical interface region, rather than uniformly increasing insulating thickness throughout the structure. The dielectric part has a first region with higher relative dielectric constant than the insulating part, positioned adjacent to the first electrode, and a second region with relative dielectric constant equal to or higher than the first region, extending from the first region away from the first electrode.

Inventive Principle:
Principle #3Local quality

2Reliability

If the thickness of the insulating part is increased to reduce electric field concentration, then the resistance to dielectric breakdown is improved, but the chip area increases

Engineering Contradiction:
Improveresistance to dielectric breakdownVSAvoidchip area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent changes the dielectric parameter (relative dielectric constant) of the material in the first dielectric part to be higher than that of the insulating part. This parameter change allows the electric field to be redistributed more effectively in the existing space, reducing peak field concentration without requiring increased physical dimensions of the insulating structure. The higher dielectric constant material naturally draws electric field lines into itself, providing breakdown protection within the same footprint.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If different dielectric constants are used in different regions, then the electric field distribution is optimized, but the device complexity increases

Engineering Contradiction:
Improveelectric field distributionVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The dielectric part is segmented into distinct regions with different dielectric properties: a first region adjacent to the electrode with higher relative dielectric constant, and a second region extending away from the electrode with equal or higher dielectric constant. This segmentation allows targeted electric field management at the critical electrode interface while maintaining simpler material properties in regions further away, optimizing the balance between field distribution and manufacturing complexity.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively improves resistance to dielectric breakdown by distributing electric field lines, reducing the risk of breakdown without increasing manufacturing costs or substrate warping, while maintaining efficient signal transmission.

Implementation Method 1

distributing electric field lines and reducing concentration

Methodology Applied
Scientific EffectElectric field distribution: Electric Field

Implementation Method 2

A relative dielectric constant of the first dielectric part is greater than a relative dielectric constant of the first insulating part

Methodology Applied
Scientific EffectDielectric permittivity: Dielectric Permittivity

Data Source

PatentUS11736134B2Digital isolator
Publication Date: 2023.08.22 KK TOSHIBA
  • US11736134B2 patent drawing
  • US11736134B2 patent drawing

AI summary

A digital isolator according to an embodiment includes a first electrode, a first insulating part, a second electrode, a second insulating part, and a first dielectric part. The first insulating part is located under the first electrode. The second electrode is located under the first insulating part. The second insulating part is located around the first electrode along a first plane perpendicular to a first direction. The first direction is from the second electrode toward the first electrode. The first dielectric part is located between the first electrode and the second insulating part in a second direction along the first plane. The first dielectric part contacts the first electrode. A relative dielectric constant of the first dielectric part is greater than a relative dielectric constant of the first insulating part.