Multilayer Ceramic Component External Electrode Sealing
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Solution Overview
Problem
Multilayer ceramic electronic components face challenges in achieving reliable chip sealing due to insufficient or excessive glass content in external electrode pastes, leading to defects such as plating defects and infiltration of plating solutions, especially with the thinning of external electrodes.
Innovation Solution
The use of a conductive metal and insulating glass in the external electrodes, with a specific ratio of glass content and thickness, to enhance sealing properties and prevent defects, including a method of manufacturing that involves forming second external electrodes with a larger glass content and sintering at a temperature of 750°C or less.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the content of glass in the external electrode paste is increased to improve chip sealing properties, then sealing properties are improved, but plating defects occur due to glass elution to the surface
Solution Approach 1:
The patent applies different glass content ratios to different layers of the external electrode. The first external electrode layer has a glass content of 35-70 parts by weight per 100 parts by weight of conductive metal, while the second external electrode layer has a glass content of 70-200 parts by weight per 100 parts by weight of conductive metal. This local differentiation allows the inner layer to provide adequate sealing without excessive glass that would cause plating defects, while the outer layer provides additional sealing protection.
Solution Approach 2:
The external electrode is divided into multiple layers (first external electrode layer and second external electrode layer) with different glass content compositions. This segmentation allows each layer to perform its specific function optimally - the first layer provides base sealing and electrical conductivity, while the second layer enhances sealing properties without causing plating defects that would occur if the entire electrode had uniformly high glass content.
2Volume of moving object
If the external electrode is thinned to achieve small size and high capacitance, then miniaturization is achieved, but it becomes difficult to implement desired density and corner coverage performance
Solution Approach 1:
The patent changes the compositional parameters of the external electrode by incorporating glass particles with specific size ranges (0.1-10 μm) and controlling glass content ratios in different layers. This parameter optimization allows the thinned electrode to achieve adequate density and corner coverage performance despite the reduced overall thickness, preventing plating solution infiltration while maintaining miniaturization benefits.
3Volume of moving object
If the coating thickness of the external electrode is reduced, then miniaturization is achieved, but plating solution infiltration into the ceramic body occurs
Solution Approach 1:
The patent uses a composite material structure for the external electrode, combining conductive metal particles with glass particles of specific sizes and ratios. This composite structure creates a dense, well-adhered coating that prevents plating solution infiltration even when the overall electrode thickness is reduced for miniaturization. The glass component fills voids and enhances adhesion between the metal layer and ceramic body.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the sealing properties and reliability of multilayer ceramic components by preventing plating solution infiltration and reducing the risk of defects, while maintaining high temperature insulation resistance.
Implementation Method 1
include glass as an auxiliary material to thereby serve to provide adhesion between the external electrode and the chip simultaneously with filling voids during sintering shrinkage of a metal
Implementation Method 2
include glass as an auxiliary material to thereby serve to provide adhesion between the external electrode and the chip
Data Source
AI summary
There are provided a multilayer ceramic electronic component and a method of manufacturing the same. The multilayer ceramic electronic component includes: a ceramic body including a dielectric layer; first and second internal electrodes disposed within the ceramic body to face each other, while having the dielectric layer interposed therebetween; and first external electrodes electrically connected to first and second internal electrodes and second external electrodes formed on the first external electrodes, wherein the first and second external electrodes include a conductive metal and a glass, and when the second external electrodes are divided into three equal parts in a thickness direction, an area of the glass in central parts thereof with respect to an area of the central parts is 30 to 80%. Therefore, sealing properties of a chip is improved, whereby a multilayer ceramic electronic component having improved reliability may be implemented.