Ceramic Capacitor Grain-Boundary Phase for Sub-0.6 μm Dielectric Reliability
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Solution Overview
Problem
The challenge in miniaturizing multilayer ceramic capacitors lies in reducing the thickness of dielectric layers while maintaining high reliability and dielectric constant, as thinner layers increase the electric field and risk of breakdown voltage and reliability deterioration.
Innovation Solution
Incorporating a secondary phase with Sn, a rare-earth element, and a first subcomponent, such as Si or Mg, into the grain boundaries of the dielectric layer, which forms a core-shell structure with specific Sn content gradients to enhance grain boundary resistance and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of the dielectric layer is decreased to achieve miniaturization, then the size of the ceramic electronic component is reduced, but the electric field applied to the dielectric increases and reliability deteriorates
Solution Approach 1:
The patent applies local quality by creating a core-shell structure where the shell region surrounding each grain core contains a secondary phase with specific Sn, rare-earth element, and first subcomponent composition. This localized modification at the grain boundaries enhances the dielectric properties and reliability specifically at critical interfaces without requiring overall thickening of the dielectric layer, thus resolving the contradiction between miniaturization and reliability.
Solution Approach 2:
The patent employs composite materials by incorporating a secondary phase consisting of Sn, rare-earth elements (such as Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb), and first subcomponents (such as Si, Mg, and Al) into the grain boundaries. This composite structure at the grain boundaries improves the dielectric constant and reliability, allowing the use of thinner dielectric layers while maintaining performance requirements.
2Volume of moving object
If the thickness of the dielectric layer is decreased to achieve miniaturization, then the size of the ceramic electronic component is reduced, but the dielectric constant may be compromised
Solution Approach 1:
The patent applies local quality by creating a core-shell structure where the shell region surrounding each grain core contains a secondary phase with specific Sn, rare-earth element, and first subcomponent composition. This localized modification at the grain boundaries enhances the dielectric properties and reliability specifically at critical interfaces without requiring overall thickening of the dielectric layer, thus resolving the contradiction between miniaturization and reliability.
Solution Approach 2:
The patent employs composite materials by incorporating a secondary phase consisting of Sn, rare-earth elements (such as Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb), and first subcomponents (such as Si, Mg, and Al) into the grain boundaries. This composite structure at the grain boundaries improves the dielectric constant and reliability, allowing the use of thinner dielectric layers while maintaining performance requirements.
Data Source
AI summary
A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains. The grain boundary includes a secondary phase including Sn, a rare-earth element, and a first subcomponent. The rare-earth element includes at least one of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb. The first subcomponent includes at least one of Si, Mg, and Al.