Ceramic Carrier Substrate with Segmented Conductor Substructures
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Solution Overview
Problem
Current electronic units face challenges in achieving high power handling with operational reliability and compact construction, as existing substrates like AMB and DBC require complex and costly mounting and bonding technologies to separate logic and drive circuits.
Innovation Solution
A ceramic carrier substrate with interconnected ceramic layers and distinct conductor substructures for high-current and signal tracks, allowing for simplified heat dissipation and electrical connection, enabling integration of power and drive electronics in a single substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If separate substrates are used for power circuit and drive circuit, then current-carrying capacity is improved, but device complexity and mounting cost increase
Solution Approach 1:
The patent combines power circuit substrate and drive circuit substrate into a single integrated ceramic carrier substrate. The substrate includes a first region with high-current conductor tracks for power circuits and a second region with signal conductor tracks for drive circuits, eliminating the need for separate substrates and complex mounting technologies while maintaining high current-carrying capacity
Solution Approach 2:
The substrate is segmented into functionally distinct regions: a first region optimized for high-current power circuits with thick copper metallization and enhanced heat dissipation, and a second region for low-current drive circuits with standard conductor tracks. This segmentation allows each region to be optimized for its specific function while being integrated in a single substrate
2Power
If thick copper metallization is applied for high current, then current-carrying capacity is improved, but heat dissipation becomes more challenging
Solution Approach 1:
The substrate implements local quality optimization by providing enhanced heat dissipation structures specifically in the first region where thick copper metallization for high-current circuits is applied. This includes increased thermal conductivity material and enhanced heat dissipation pathways in the power circuit region, while the second region for drive circuits uses standard thermal management
Solution Approach 2:
The ceramic substrate material acts as an intermediary that thermally decouples the high-current region from the drive circuit region. The substrate's thermal properties are optimized to conduct heat away from the thick copper metallization area while preventing heat transfer to the sensitive drive circuit components in the second region
3Ease of manufacture
If conductor tracks are applied by screen printing, then ease of manufacture is improved, but conductor track thickness and current capacity are limited
Solution Approach 1:
The patent changes the conductor track parameters by applying multiple layers of conductive paste through screen printing and firing, building up thick copper metallization (tens of micrometers) in the first region. This multi-layer approach maintains the simplicity of screen printing while achieving the conductor thickness needed for high current capacity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances current-carrying capacity, reduces heating of the drive circuit, and eliminates the need for complex mounting technologies, achieving high power handling with efficient heat dissipation and compact design.
Implementation Method 1
The interconnected structure is in particular formed by a firing operation
Implementation Method 2
the thick copper metallization is essential from a thermal and an electrical standpoint
Implementation Method 3
the thick copper metallization is essential from a thermal and an electrical standpoint
Implementation Method 4
The heat sink is in particular a heat dissipator, for example a heat dissipator with a cooling medium flowing through it
Implementation Method 5
a heat dissipator with a cooling medium flowing through it
Data Source
AI summary
A ceramic carrier substrate for an electrical/electronic circuit. The substrate includes ceramic layers arranged one above the other in an interconnected structure and conductor tracks arranged on and/or in individual ceramic layers and connected to one another as the conductor structure for the electrical/electronic circuit. The interconnected structure is formed by a firing operation. A first conductor substructure is formed in a first interconnected structure subassembly which comprises at least one of the ceramic layers, and a second conductor substructure is formed in a second interconnected structure subassembly which is directly adjacent to the first interconnected structure subassembly and comprises at least one of the ceramic layers. The second conductor substructure substantially consists of high-current conductor tracks and is configured to contact a power circuit. The first conductor substructure substantially consists of signal conductor tracks and is configured to contact a drive circuit for the power circuit.