Printed Circuit Aspects TRIZ Cases

Tubular sleeves on a printed circuit board accept electromagnetic coils directly, eliminating precise orientation requirements during assembly.

Embedding passive devices in a glass substrate with metal via pillars eliminates ion migration risks while maintaining high packaging density.

Low-temperature curing adhesive layers prevent etiolating and preserve printed circuit board transparency during high-pressure lamination.

A flexible circuit board assembly uses a thicker conductive heat dissipation layer bonded to the resin substrate.

A touch panel design uses a virtual pattern on the flexible circuit board to enable direct pad connections via anisotropic conductive film.

Passages in the laser stop device allow fan-out lines to connect around connector pads, reducing board thickness and simplifying decapping.

Auxiliary layer design enhances substrate rigidity for stable circuit board manufacturing.

Curved conductor side surfaces anchor metal foil and plating layers, reducing interfacial peeling in multilayer wiring substrates.

A camera device uses a spherical frame and electromagnetic drive to rotate the lens assembly for multi-axis stabilization.

A recessed terminal portion on the TFT substrate accommodates a bent flexible wiring substrate.

Asymmetric trace routing compensates for fixing part interference, resolving uneven illuminance caused by varying trace lengths in liquid curing apparatuses.

Positioning an insulating film beyond the adhesive layer prevents foreign material contamination from broken bonding layers.

A multilayer wiring substrate links vias through a metal-filled small hole, preventing plating voids and peeling under tensile stress.

A configurable pressing fixture uses hollow screws with weighted pins to secure electronic components during wave soldering.

A layered glass ceramic laminate uses distinct surface and inner layer compositions to balance chemical durability with low permittivity.

A polymer thick film dielectric paste composition uses a low-viscosity resin blend to form flexible layers.

A ceramic wiring member uses a tungsten and nickel alloy electroconductive portion with dispersed glass phase.

A compact measurement device uses a shunt resistor and temperature sensor for accurate power monitoring.

A main board integrates a Trusted Platform Module chip within a predetermined area defined by a perforated break line.

A circuit board structure embeds electronic components within dielectric blocks and utilizes metal layers to conduct heat away from the core.

Regenerating nickel-chromium removal liquid with specific chelate resin prevents wiring peeling caused by high copper concentrations.

A laminated circuit board integrates a built-in inductor using stacked metal layers with bonded electrodes to establish electrical connectivity.

Circuit board seals container sidewall opening to prevent dielectric liquid leakage while maintaining airtight power connections.

Active ester curing agents in the epoxy resin composition eliminate polar groups, resolving the trade-off between heat resistance and dielectric loss values.

Stacked circuit boards form windings around parallel magnetic plates to reduce parasitic inductance and uneven current distribution.

A non-aqueous composition removes organic resin from copper surfaces, preventing mechanical damage and ensuring reliable metal adhesion.

A composite board material combines polyethylene terephthalate inner layers with polyimide outer layers bonded by adhesive.

Segmented conductor substructures in a ceramic carrier substrate integrate power and drive circuits, reducing heating of the drive circuit.

Spring-loaded posts eliminate glue shrinkage to maintain alignment precision during LiDAR assembly.

A printed wiring board uses varied thermal expansion coefficients in buildup layers to manage stress and prevent warping.

Chemical dissolution and mechanical abrasion of the contact area removes non-conductive polymer to lower electrical resistance.

Optimized BaTi4O9 filler dispersion balances high permittivity against low dissipation factor and thermal expansion in printed wiring boards.

Segmented pad regions allow direct replacement of faulty LED chips, reducing reworking steps and preventing thermal damage to the circuit board.

Curved auxiliary structures guide flexible member bending to reduce mechanical stress and prevent breakage during assembly.

Straight air ducts link row-mounted heat sinks to channel fan airflow across thermal management components.

Conductor traces with constrictions route short-circuit current to destroy insulation and create an auxiliary path.

Third build-up layers with 3 μm width and 2.0 to 4.0 aspect ratio increase wiring density while maintaining signal integrity.

Fe-Ni-Si alloy powder in a thermosetting resin balances high relative magnetic permeability with low magnetic loss.

A lead pin bonding surface features a central flat area surrounded by a convex ring to hold solder during reflow.

An exposed first metal layer serves as both an etching barrier and surface treatment, eliminating separate processing steps that complicate manufacturing.

A resin composition uses epoxy and inorganic fillers to enhance adhesive strength between conductive wires and insulating films.

An arc-shaped capacitive fingerprint identification apparatus uses high-temperature UV glue to form a curved sensing surface.

Metallic vias connect copper layers through fiber-reinforced resin to dissipate LED heat while maintaining mechanical strength against vibration.

Combining a fluorene skeleton diamine with a dimer diamine yields a polyimide film that prevents signal delays in high-frequency devices.

A resin composition blends maleimide, cyanate ester, epoxy, and inorganic filler to create a high-performance laminate.

Segmenting the substrate into rigid high-connectivity zones and exposed flexible regions resolves stiffness issues while maintaining electrical integrity.

A lighting device uses segmented external pads to electrically couple an integrated circuit chip for pre-installation verification.

Segmented FPC connector with conductive strips allows easy board insertion, eliminating welding damage and enabling reuse.

A metal thin film with a linear slit directs heat flow to suppress electromotive force noise without increasing apparatus size.