Composite Board Material for Flexible Printed Circuits
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Solution Overview
Problem
Existing flexible printed circuit materials fail to effectively balance flatness, hardness, and cost requirements for diverse electronic device applications, limiting their adaptability and cost performance.
Innovation Solution
A composite board material is developed, comprising a polyethylene terephthalate (PET) inner layer and polyimide (PI) outer layers bonded with resin adhesive layers, optionally including a release layer, to achieve balanced flatness, hardness, and cost efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If PET materials are used to reduce cost, then material cost decreases, but flatness and hardness performance deteriorate
Solution Approach 1:
The patent applies composite materials by combining PET and PI materials in a layered structure. The PET layer provides cost effectiveness and basic structural integrity, while the PI layer provides enhanced flatness and hardness. This composite approach allows the FPC to achieve both cost reduction and improved mechanical properties simultaneously, resolving the contradiction between material cost and flatness performance.
2Manufacturing precision
If PI materials are used to improve flatness and hardness, then flatness and hardness performance improve, but material cost increases
Solution Approach 1:
The patent applies local quality by using PI material specifically in the outer layer where flatness and hardness are most needed, while using cost-effective PET material in the inner layer. This localized application of high-performance material only where required allows the system to achieve improved flatness and hardness without incurring the full cost premium of using PI throughout the entire FPC structure.
3Device complexity
If single-layer materials are used to simplify structure, then device complexity decreases, but adaptability to different application scenarios deteriorates
Solution Approach 1:
The patent uses composite materials with different layers (PET and PI) to provide adaptability to various application scenarios. The combination allows the FPC to be customized for different requirements - the PET layer can be adjusted for cost-sensitive applications while the PI layer provides necessary mechanical properties for applications requiring high flatness and hardness. This layered composite structure enables a single material system to adapt to multiple application scenarios.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite board material enhances the adaptability and cost performance of flexible printed circuits by optimizing flatness, hardness, and material cost, making them suitable for various application scenarios.
Implementation Method 1
The first material layer is bonded to the two second material layers by adhesive layers
Data Source
AI summary
The present disclosure provides a composite board material and a flexible printed circuit. The composite board material includes a first material layer, and two second material layers attached to top surface and bottom surface of the first material layer opposite to each other, respectively. The first material layer is bonded to the two second material layers by adhesive layers. The first material layer includes at least one sublayer, and a material of the at least one sublayer includes polyethylene terephthalate. A material of the two second material layers includes polyimide. In this composite board material, polyethylene terephthalate material functions as inner layer(s), and polyimide material functions as outer layers. In this way, the flatness, hardness, and cost of materials can be balanced, thereby making the obtained flexible printed circuit adaptive to various application scenarios and improving the cost performance of the products.