Resin Composition for Printed Wiring Boards
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Solution Overview
Problem
Current resin compositions for printed wiring boards face challenges in achieving high flame retardance, low water absorption, and high glass transition temperature without using halogenated or phosphorus compounds, while maintaining moldability and elastic modulus at high temperatures.
Innovation Solution
A resin composition blending a maleimide compound, a cyanate ester compound, an epoxy resin, and an inorganic filler, along with a bismaleimide triazine resin, provides excellent flame retardance, low water absorption, and high glass transition temperature, achieved through specific formulations and processing conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the glass transition temperature of the laminate is low, then the coefficient of thermal expansion difference between the laminate and sealing resin increases at solder reflow temperatures, but this causes warpage and production faults
Solution Approach 1:
The patent changes the chemical composition parameters of the resin system by using a phenolic resin with specific hydroxyl group content (0.05-0.5 mmol/g) and specific gravity (1.10-1.20), along with controlled amounts of cyanate ester and bismaleimide compounds, to achieve a glass transition temperature of 260°C or higher while maintaining dimensional stability during solder reflow processing
2Temperature
If the amount of inorganic filler is increased to attain a glass transition temperature of 260°C or more, then the flame retardance and heat resistance improve, but the moldability deteriorates
Solution Approach 1:
The patent optimizes the chemical parameters of the organic resin component by controlling the hydroxyl group content (0.05-0.5 mmol/g) and specific gravity (1.10-1.20) of the phenolic resin, and the molar ratios of cyanate ester to epoxy resin (0.7-2.5) and bismaleimide to cyanate ester (0.5-2.0), to achieve high glass transition temperature (260°C or more) while maintaining good moldability without excessive inorganic filler
Solution Approach 2:
The patent creates a composite resin system combining phenolic resin, cyanate ester, and bismaleimide compounds in specific proportions, where the synergistic interaction between these materials allows achieving high heat resistance and glass transition temperature while maintaining processability and moldability
3Temperature
If a novolac-based cyanate ester resin is used to raise the glass transition temperature, then the heat resistance improves, but the curing completeness and water absorption ratio deteriorate
Solution Approach 1:
The patent modifies the cyanate ester component by controlling the molar ratio of cyanate ester to epoxy resin (0.7-2.5) and combining it with bismaleimide compounds, ensuring complete curing and low water absorption while achieving high glass transition temperature
Solution Approach 2:
The patent combines cyanate ester with bismaleimide and phenolic resin in a composite system where the bismaleimide compound (at molar ratio 0.5-2.0 relative to cyanate ester) acts as a complementary curing agent that ensures complete curing and reduces water absorption while maintaining high heat resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting metal foil-clad laminate exhibits superior flame retardance, low water absorption, and high elastic modulus at high temperatures, making it suitable for high-reliability printed wiring boards with improved heat resistance.
Implementation Method 1
blending a maleimide compound having a specific structure (1), a cyanate ester compound having a specific structure (2), a non-halogen epoxy resin (3), an inorganic filler (D), and an imidazole compound (F)
Implementation Method 2
low water absorption ratio
Data Source
AI summary
[Problem to be Solved] It is an object of the present invention to provide, without using a halogenated compound or a phosphorus compound, a resin composition for printed wiring boards, a prepreg, a laminate, and a metal foil-clad laminate, each of which has high-degree flame retardance, has a low water absorption ratio and a high glass transition temperature, and has a high elastic modulus at high temperature. [Solution] A resin composition according to the present invention comprises: a specific maleimide compound (A); a cyanate ester compound (B); a non-halogen epoxy resin (C); and an inorganic filler (D).