Chip Package Circuit Board Module Pad Segmentation
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Solution Overview
Problem
The reworking process of LED chip packages on circuit boards is challenging due to potential damage from high temperatures, thermal expansion, and yield reduction, especially when copper wires peel off and pads are damaged, requiring complex and time-consuming replacement procedures.
Innovation Solution
A chip package circuit board module design featuring separate first, second, and substitute pads, with conductive members connecting these pads, allows for direct replacement of an inoperative original chip with a substitute chip without removing the original chip, reducing the reworking process steps and maintaining circuit board reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If high temperature is applied to peel off the LED chip, then the chip can be removed, but the circuit board exhibits thermal expansion or contraction which damages the circuit board and lowers reliability
Solution Approach 1:
The pad is divided into multiple independent regions (first pad region, second pad region, third pad region) that can be selectively processed. This allows the chip to be removed from one region without subjecting the entire circuit board to high temperature, thus avoiding thermal expansion damage while enabling chip removal.
Solution Approach 2:
Different regions of the pad are designed with different properties - the first pad region maintains normal adhesion for reliable connection, while the second pad region has modified properties to facilitate chip removal without requiring high temperature across the entire board. This local differentiation enables selective chip removal without compromising overall circuit board reliability.
2Ease of repair
If high temperature is applied to peel off the LED chip, then the chip can be removed, but copper wires on the surface of the circuit board are peeled off together
Solution Approach 1:
The pad is segmented into multiple regions with different adhesion characteristics. The second pad region is specifically designed to allow chip removal without transferring to copper wires, while the first and third regions maintain normal adhesion. This segmentation prevents copper wire peeling during chip removal.
Solution Approach 2:
The second pad region has locally modified properties that enable chip removal without affecting copper wires. This local quality differentiation ensures that the peeling action is confined to the intended region and does not harm surrounding copper wire structures.
3Ease of repair
If the LED chip is peeled off, then the chip can be replaced, but the pads may be damaged which reduces yield when packaging the new chip at the same position
Solution Approach 1:
The pad is divided into multiple regions where the second pad region is designed for easy chip removal while the first and third regions maintain intact pad structures. This allows chip removal from one region without damaging pads in other regions, ensuring high yield when replacing chips at the same position.
Solution Approach 2:
The pad regions are pre-designed with different properties during manufacturing, with the second region prepared to facilitate chip removal while preserving pad integrity in other regions. This preliminary design ensures that future chip replacements can be performed without damaging the pads.
4Ease of repair
If separate second pad and substitute pad are added beside the first pad, then chip replacement is simplified and yield is improved, but the device complexity increases
Solution Approach 1:
The first pad, second pad, and third pad are merged into a single integrated pad structure that functions as one unit. This merging approach allows chip replacement functionality while maintaining a unified pad design that does not significantly increase overall device complexity.
Solution Approach 2:
The multi-region pad structure serves multiple functions: the first region provides normal adhesion for reliable connection, the second region enables chip removal, and the third region provides additional functionality. This multi-functionality allows a single pad structure to replace what would traditionally require separate components, reducing overall complexity.
Data Source
AI summary
A chip package circuit board module including a circuit board and at least one original chip is provided. The circuit board includes at least one first pad, at least one second pad and at least one substitute pad. The at least one second pad is located besides the at least one first pad and separated from the at least one first pad. The at least one substitute pad is adjacent to the at least one second pad and separated from the at least one first pad and the at least one second pad. The at least one original chip is connected to the at least one first pad and at least one the second pad, respectively. A total width of a portion corresponding to each of the at least one second pad and a portion corresponding to the substitute pad adjacent to the second pad of the first pad is greater than or equal to twice a width of the original chip.