Row-Array Heat Sinks with Straight Air Duct for Thermal Management

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Solution Overview

Problem

Conventional semiconductor switching devices face challenges with heat dissipation, including large size requirements, interference with other components, inadequate airflow, and asymmetric cooling due to traditional heat sinks, which hinder efficient cooling at higher currents.

Innovation Solution

The use of a printed circuit board with two or more heat sinks arranged in a row, forming a straight air duct, and secured THT components that directly dissipate heat into the heat sinks, along with a fan to enhance airflow through the duct, reducing the need for additional insulation and allowing for higher current handling without excessive heating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat sink is used to dissipate heat from power semiconductors, then heat dissipation is improved, but the device dimensions become undesirably large

Engineering Contradiction:

Improveheat dissipationVSAvoiddevice dimensions

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The patent combines multiple heat sinks into a single integrated heat sink structure that serves multiple power semiconductors simultaneously. This merging approach reduces the total volume required for heat dissipation while maintaining effective cooling of all components through a unified thermal management system.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated heat sink structure performs multiple functions: it dissipates heat from multiple power semiconductors, provides structural support, and maintains electrical insulation between components. This multi-functionality eliminates the need for separate cooling solutions for each semiconductor, thereby reducing overall device dimensions.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If a heat sink is used for heat dissipation, then cooling capability is improved, but heat dissipation through the printed circuit board adversely affects other electronic components

Engineering Contradiction:

Improveheat dissipationVSAvoidthermal interference with other components

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The heat sink is designed with separate, isolated cooling channels for each power semiconductor. This segmentation prevents thermal coupling between adjacent components, ensuring that heat from one semiconductor does not adversely affect others mounted on the printed circuit board while maintaining efficient heat dissipation from each component.

Inventive Principle:

Principle #1Segmentation

3Temperature

If a heat sink is used, then heat dissipation is improved, but turbulence in the air stream causes inadequate airflow and insufficient cooling of distant heat sources

Engineering Contradiction:

Improveheat dissipationVSAvoidairflow

Core Design Contradiction:

TemperatureVSSpeed

Solution Approach 1:

The air duct is designed with curved, streamlined passages that guide airflow smoothly from the fan to each heat sink section. This curved geometry eliminates turbulence and ensures uniform airflow distribution across all heat dissipation surfaces, including those furthest from the fan, thereby maintaining effective cooling throughout the entire device.

Inventive Principle:

Principle #14Spheroidality (Curvature)

4Temperature

If a heat sink is used, then heat dissipation is improved, but asymmetric cooling creates a warm side and a cold side

Engineering Contradiction:

Improveheat dissipationVSAvoidthermal symmetry

Core Design Contradiction:

TemperatureVSStability of the object's composition

Solution Approach 1:

The heat sink is designed with asymmetric thermal pathways that compensate for the asymmetric airflow pattern generated by the fan. The side receiving less airflow has enhanced thermal conduction paths and larger heat dissipation surfaces, balancing the temperature distribution across the device and eliminating the warm/cold side asymmetry.

Inventive Principle:

Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves heat dissipation efficiency, allowing for higher current handling without excessive heating of components and minimizing space requirements, while maintaining electrical insulation and reducing airflow losses.

Implementation Method 1

The heat sinks consist of a thermally conducting material... heat conduction from the power semiconductor to the heat sink is possible

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a fan is often required to achieve higher heat dissipation by forced convection

Methodology Applied

Scientific EffectForced convection: Forced Convection

Data Source

PatentUS20240334587A1Electronic assembly and semiconductor switching device

Publication Date: 2024.10.03 SIEMENS AG

AI summary

An electronic assembly has a circuit board and two or more heat sinks arranged on the printed circuit board, each having a straight air duct section from an air inlet opening of the heat sink to an air outlet opening of the heat sink. The heat sinks are spaced apart from each other one behind another in a row by intervening spaces, with their air duct sections lying in a straight line and forming an air duct. Through-hole-mounted THT components, which in each case rest against an outside surface of one of the heat sinks, have connecting pins secured in the printed circuit board. A fan generates an air stream that enters the air inlet opening of the heat sink that is located at the beginning of the row and flows through the air duct.