Polyimide Film Low Dielectric Fluorene Dimer
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Solution Overview
Problem
Common polyimides used in insulative materials for high-frequency electronic devices exhibit high dielectric properties, leading to signal delays and heat generation, while polyamic acids with fluorene skeletons have insufficient film formability, failing to produce polyimides with both low dielectric properties and high heat resistance.
Innovation Solution
A polyamic acid composition obtained through a polyaddition reaction between a tetracarboxylic dianhydride and diamines, including both a diamine with a fluorene skeleton and a dimer diamine, which improves film formability and heat resistance while maintaining low dielectric properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If common polyimides are used for insulative materials, then heat resistance and mechanical properties are improved, but dielectric constant increases causing signal delays and heat generation
Solution Approach 1:
The patent changes the chemical structure parameters of the polyimide by incorporating fluorene skeletons into the diamine component, which reduces the polarity of the entire molecule and lowers the dielectric constant while maintaining heat resistance properties
Solution Approach 2:
The patent creates a composite polyimide structure by combining fluorene-containing diamine with specific acid dianhydrides, achieving a material that simultaneously exhibits low dielectric constant and high heat resistance through the synergistic effect of different molecular components
2Reliability
If fluorene skeleton is introduced to decrease dielectric constant, then low dielectric property is improved, but film formability deteriorates
Solution Approach 1:
The patent optimizes the molecular weight and structural parameters of the fluorene-containing diamine to achieve a balance between low dielectric constant and good film formability, ensuring the polyamic acid solution has appropriate viscosity and flow characteristics for film formation
Solution Approach 2:
The patent introduces specific substituents (R1 to R4) at different positions of the fluorene skeleton to locally modify the molecular properties, improving film formability in specific regions while maintaining the overall low dielectric constant property of the polyimide
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting polyimide exhibits good film formability, low dielectric properties, and high heat resistance, making it suitable for use in high-frequency electronic devices such as printed circuit boards without causing signal delays or heat-related malfunctions.
Implementation Method 1
a polyimide obtained by imidizing the above polyamic acid
Implementation Method 2
a polyamic acid that is a product obtained by polyaddition reaction between a tetracarboxylic dianhydride (A) and at least two diamines (B)
Data Source
AI summary
The present disclosure is related to providing a polyamic acid that can form a polyimide exhibiting a low dielectric property and high heat resistance and that has good film formability, and a polyamic acid composition, polyimide, polyimide film, and printed circuit board that are produced by using this polyamic acid. A polyamic acid that is a product obtained by polyaddition reaction between a tetracarboxylic dianhydride (A) and at least two diamines (B), wherein the at least two diamines (B) contain a diamine having a fluorene skeleton (B1) and a dimer diamine (B2).