Flexible LED Circuit Board Heat Dissipation Layer

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Solution Overview

Problem

Conventional flexible circuit boards for LED lamps face challenges in maintaining shape and improving heat dissipation, especially when used in curved designs for vehicle lighting, where existing substrates are prone to damage and ineffective in managing heat generated by high-heat components like LEDs.

Innovation Solution

A flexible circuit board assembly featuring a resin layer with a conductive signal line layer on top and a thicker heat dissipation layer on the bottom, made of copper, aluminum, or their alloys, where the heat dissipation layer is 1.5 to 4 times thicker and connected to the signal line layer through a heat transfer layer, enhancing heat transfer and maintaining shape flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a conventional flexible circuit board with a circuit pattern layer on a flexible resin layer is used, then flexibility is achieved, but the shape cannot be maintained and heat dissipation is poor

Engineering Contradiction:

ImproveflexibilityVSAvoidshape maintenance

Core Design Contradiction:

Adaptability or versatilityVSShape

Solution Approach 1:

The patent uses a composite structure consisting of a flexible resin layer, a circuit pattern layer, and a reflective layer. This composite material approach allows the circuit board to maintain flexibility while the reflective layer provides structural support to maintain the curved shape in lamp units.

Inventive Principle:

Principle #40Composite materials

2Adaptability or versatility

If a conventional flexible circuit board with a circuit pattern layer on a flexible resin layer is used, then flexibility is achieved, but heat dissipation cannot be improved

Engineering Contradiction:

ImproveflexibilityVSAvoidheat dissipation

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent employs a composite structure with a flexible resin layer, circuit pattern layer, and reflective layer. The reflective layer serves dual purposes: maintaining shape and providing heat dissipation pathways for the LED components while preserving the flexibility needed for curved installations.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The reflective layer performs multiple functions simultaneously: it maintains the curved shape of the flexible circuit board, dissipates heat from the LED components, and provides electrical insulation. This multi-functionality resolves the contradiction between flexibility and heat dissipation capability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Temperature

If an aluminum substrate with copper plate and epoxy-based adhesive is used, then heat dissipation is improved, but the adhesive peels off at high temperatures

Engineering Contradiction:

Improveheat dissipationVSAvoidadhesive bonding

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent changes the material parameters by using a reflective layer with specific thermal and adhesive properties that remain stable at high temperatures. This reflective layer maintains strong bonding to the flexible resin layer even under thermal stress, preventing the peeling issue experienced with epoxy-based adhesives on aluminum substrates.

Inventive Principle:

Principle #35Parameter changes

4Reliability

If a ceramic-based adhesive is used to resist heat, then adhesive bonding is improved, but the cost increases

Engineering Contradiction:

Improveadhesive bondingVSAvoidcost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent employs a cost-effective reflective layer material that provides heat-resistant adhesive bonding properties without the high cost of ceramic-based adhesives. This approach maintains reliability at high temperatures while being economically viable for mass production in automotive lighting applications.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively improves heat dissipation and maintains the flexible circuit board's shape, increasing design freedom and applicability, while simplifying the assembly structure and enhancing productivity by eliminating the need for additional support cases.

Implementation Method 1

a heat dissipation layer formed on a lower surface of the resin layer, having a thickness relatively thicker than that of the signal line layer having conductivity and dissipates heat generated from an light emitting diode mounted on the signal line layer

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10477670B2Flexible circuit board assembly for LED lamp

Publication Date: 2019.11.12 LEDLITEK

AI summary

A flexible circuit board assembly for an LED lamp of the present disclosure comprises: a resin layer having a strip shape; a conductive signal line layer formed from a predetermined pattern provided on the upper part of the resin layer; and a radiation layer provided on the lower part of the resin layer, having a thickness relatively thicker than that of the conductive signal line layer, and radiating the heat generated from an LED mounted on the signal line layer, wherein the signal line layer and the radiation layer are made from one material from among copper, aluminum, copper alloy and an aluminum alloy.