PCB Cap Layer Passages for Fan-Out Line Routing
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Solution Overview
Problem
The existing methods for producing printed circuit boards face challenges in miniaturization, as the conventional laser stop devices completely surround the connector pads, preventing fan-out lines from connecting to the rest of the board, which increases the board's thickness and complicates the decapping process, especially when more uncut areas in the cap layer are required for smaller electronic components.
Innovation Solution
A semi-finished product with a cap layer having openings in registration with passages in the laser stop device, allowing fan-out lines to pass through and connect to the conductive layer, and a release layer to facilitate easy removal of the cap layer, using a CO2 laser to cut the cap layer in the L-shaped segments, and employing a low-flow prepreg to prevent resin flow into the openings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the laser stop device completely surrounds the connector pad, then the laser can cut around the connector pad to liberate the cap layer, but the fan-out lines cannot connect to the rest of the board and the board thickness increases
Solution Approach 1:
The laser stop device is segmented into multiple sections by introducing passages through it, allowing the fan-out lines to pass through and connect to the rest of the board while maintaining the ability to cut around the connector pad in the remaining sections
Solution Approach 2:
The fan-out lines are routed through the thickness dimension by passing through passages in the laser stop device, allowing connections without increasing the planar board thickness
2Adaptability or versatility
If the laser stop device completely surrounds the connector pad, then the laser can cut around the connector pad, but more uncut areas in the cap layer are required for smaller electronic components which complicates the decapping process
Solution Approach 1:
The cap layer is segmented by opening passages through the laser stop device, creating separate uncut areas that can be independently removed while maintaining the structural integrity needed for miniaturized components
Solution Approach 2:
The passages in the laser stop device act as intermediaries, allowing the cap layer to be opened and removed in a controlled manner while preserving the connector pad and surrounding structures needed for miniaturized electronics
3Ease of manufacture
If fan-out lines are designed to stop before the laser stop device, then the laser stop device can be crossed in a conductive layer above the cap layer, but the overall thickness of the printed circuit board increases
Solution Approach 1:
The fan-out lines utilize the thickness dimension by passing through passages in the laser stop device, allowing them to cross the conductive layer without requiring additional thickness in the board structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient decapping of connector pads by allowing fan-out lines to connect all around the connector pad, reducing the thickness of the printed circuit board and simplifying the decapping process, while maintaining the structural integrity and miniaturization needs of high-performance electronic components.
Implementation Method 1
This is usually done by laser-cutting. To this end, a CO 2 laser is deployed to cut through the insulating layers above the target layer.
Data Source
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AI summary
In a semi-finished product (1) for the production of a printed circuit board with at least one recessed electronic component having at least one conductive layer (13) structured to provide a connector pad (3) for an electronic component, fan-out lines (4) connected to the connector pad (3) and further to provide at least one laser-stop device (6) encompassing the connector pad (3), wherein the laser-stop device (6) has at least one passage (8) for passing-through the fan-out lines (4), the semi-finished product (1) further comprises at least one cap layer (2') applied to the conductive layer (13), the at least one cap layer (2') having an opening (11) in registration with each passage (8). The inventive method for producing a printed circuit board with at least one recessed component, is characterised by the steps of providing at least one conductive layer (13), structuring said conductive layer (13) to provide a connector pad (3) for an electronic component, fan-out lines (4) connected to the connector pad (3) and further to provide at least one laser-stop device (6) encompassing the connector pad (3), leaving at least one passage (8) in the laser-stop device (6) for passing-through the fan-out lines (4), and applying a cap layer (2') to said conductive layer (13), the cap layer (2') having an opening (11) in registration with each passage (8).