Circuit Board Structure With Embedded Blocks And Metal Core For Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Circuit boards with embedded electronic components face poor heat dissipation and assembly challenges due to the core layer's effective heat dissipation, leading to difficulties in welding non-embedded components or wafer packages.
Innovation Solution
A circuit board structure with a dielectric substrate, embedded blocks, build-up circuit layers, conductive through holes, and a fine redistribution layer, which includes a non-electroplating metal layer and thermal interface material to improve heat dissipation and assembly, while maintaining module density and signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the core layer is replaced with metal material to improve heat dissipation, then heat dissipation performance is improved, but assembly difficulty increases due to failure of solder balls to form
Solution Approach 1:
The patent applies local quality by creating a dual-layer core structure where the first core layer (metal) provides heat dissipation in specific regions, while the second core layer (dielectric) provides welding surfaces in other regions. This localized differentiation allows heat dissipation improvement where needed while maintaining weldability where required, resolving the contradiction between heat dissipation performance and assembly ease.
Solution Approach 2:
The patent uses composite materials by combining metal and dielectric materials in a layered core structure. The metal first core layer provides thermal conductivity for heat dissipation, while the dielectric second core layer provides electrical insulation and welding surfaces. This composite approach allows simultaneous achievement of heat dissipation performance and assembly ease that neither material could achieve alone.
2Quantity of substance
If electronic components are embedded to increase module density, then module density is improved, but heat dissipation becomes poorer
Solution Approach 1:
The patent merges the heat dissipation function with the embedding structure by making the first core layer (metal) serve dual purposes: providing thermal pathways for heat dissipation and serving as the matrix in which electronic components are embedded. This integration allows high module density through embedding while maintaining effective heat dissipation through the metal core layer, resolving the contradiction between density and thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure enhances heat dissipation and assembly by embedding electronic components, reducing signal loss, and improving module density and signal integrity through efficient heat transfer and noise protection.
Implementation Method 1
a thermal interface material, disposed between the electronic component and the embedded block
Implementation Method 2
The first non-electroplating metal layer directly contacts the second non-electroplating metal layer. The first non-electroplating metal layer and the second non-electroplating metal layer are located between the connection pad and the connector.
Data Source
AI summary
A circuit board structure includes a dielectric substrate, at least one embedded block, at least one electronic component, at least one first build-up circuit layer, at least one second build-up circuit layer, at least one conductive through hole, and a fine redistribution layer (RDL). The embedded block is fixed in a through cavity of the dielectric substrate. The electronic component is disposed in an opening of the embedded block. The first build-up circuit layer is disposed on a top surface of the dielectric substrate and electrically connected with the electronic component. The second build-up circuit layer is disposed on a bottom surface of the dielectric substrate and covers the embedded block. The conductive through hole is disposed in a via of the embedded block and electrically connects the first and the second build-up circuit layers. The fine RDL is disposed on and electrically connected to the first build-up circuit layer.