Circuit Substrate Slit Suppresses Thermocouple Noise
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Solution Overview
Problem
Existing circuit boards experience significant noise and drift due to thermocouple effects from heterogeneous metal connections, which are difficult to mitigate without increasing complexity and size through thermal insulation and temperature control.
Innovation Solution
A circuit board with a metal thin film featuring a linear slit separating it into regions, allowing heat to be uniformly transferred along the slit, aligning current flow with isothermal lines to suppress electromotive forces, and maintaining a compact design by keeping regions close together.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If thermal insulation around the circuit board and temperature control are performed, then the influence of electromotive force is reduced, but the structure becomes complicated and the apparatus becomes large in size
Solution Approach 1:
The metal thin film is divided into a first region and a second region by forming a linear slit, separating the heat generation source region from the element region while maintaining a compact layout. This segmentation allows heat to be uniformed along the slit direction, creating isothermal lines parallel to the slit that suppress thermocouple effects without requiring additional thermal insulation components.
Solution Approach 2:
The patent applies different functional zones within the metal thin film: the first region handles heat generation, the slit region handles heat uniforming, and the second region handles element placement with protected signals. This local differentiation allows each region to optimize its function while working together to suppress electromotive force influence without increasing overall complexity.
2Object-affected harmful factors
If the separation distance between the heat generation source and the important component is increased, then the influence of electromotive force is reduced, but the apparatus becomes large in size
Solution Approach 1:
The linear slit acts as an intermediary structure between the heat generation source and the element. It allows heat to transfer from the first region to the second region while uniforming the temperature distribution along the slit direction. This creates isothermal conditions in the element region that suppress thermocouple effects, enabling close placement without direct thermal contact that would cause electromotive force.
Solution Approach 2:
Instead of increasing separation distance in one dimension, the patent uses the slit structure to create temperature uniformity along the length of the metal thin film. The heat flows in one direction while the isothermal lines are maintained parallel to the slit, effectively using the dimensional relationship between the slit length and width to suppress electromotive force without increasing overall apparatus size.
3Object-affected harmful factors
If thermal insulation and temperature control components are added, then electromotive force influence is reduced, but the apparatus becomes large in size
Solution Approach 1:
The patent merges the thermal management function and the electrical signal protection function into a single integrated structure - the metal thin film with linear slit. This structure simultaneously handles heat transfer from the heat generation source and protects the element region from thermocouple effects, eliminating the need for separate thermal insulation components and reducing overall apparatus volume.
Solution Approach 2:
The metal thin film with linear slit serves multiple functions: it conducts heat from the heat generation source, uniformes temperature distribution along the slit direction, creates isothermal lines to suppress thermocouple effects, and provides a compact layout structure. This multi-functionality replaces what would traditionally require multiple separate components, reducing apparatus size while maintaining effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the influence of thermocouple-induced noise and drift on minute signals, stabilizing output signals quickly and minimizing size increases, while handling low voltages with high precision.
Implementation Method 1
the heat from the heat generation source reaches the slit from the first region, the heat is uniformized in a linear shape along the slit. Therefore, the heat transferred from the first region to the second region through the slit is transferred to the second region while maintaining the isothermal line parallel to the slit
Implementation Method 2
since heterogeneous metals are connected to each other, a thermocouple effect occurs at the connection point, and thus, an electromotive force is generated at the connection point as the temperature changes
Data Source
AI summary
On a circuit board, a metal thin film is formed on a surface 101 of a board body. A linear slit is formed in a metal thin film, so that the metal thin film is separated into a first region and a second region with the slit interposed therebetween. The circuit board 1 includes a heat generation source (for example, an IC) arranged in the first region and an element arranged in the second region. A current flows through the element in a direction parallel to the slit.