Glass Embedded Passive Device Packaging for Signal Loss Reduction
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Solution Overview
Problem
Existing passive device packaging technologies, such as those using polymer matrices, face challenges with size miniaturization, high signal loss, reliability issues due to ion migration, and complex processing for high-frequency applications, particularly in electronics and communication industries.
Innovation Solution
A passive device packaging structure embedded in a glass medium, featuring a glass substrate with a capacitor and inductor in the same horizontal layer, utilizing a dielectric layer and metal via pillars to reduce signal loss and ion migration, and a simplified manufacturing method that includes laser-induced depth etching for precise cavity formation and layer construction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If passive devices are embedded in a polymer matrix, then packaging density is improved, but signal loss increases and dielectric constant and dielectric loss are high
Solution Approach 1:
The patent changes the dielectric material from polymer to glass, fundamentally altering the material parameters to achieve low dielectric constant (Dk<3.5) and low dielectric loss (Df<0.003), thereby reducing signal loss while maintaining packaging density
Solution Approach 2:
The patent uses glass as a dielectric material which inherently possesses low Dk and low Df properties, creating a composite embedded structure that simultaneously achieves high packaging density and low signal loss
2Reliability
If capacitor and inductor are placed in different stacking layers vertically, then electrical connection is achieved, but size miniaturization is affected
Solution Approach 1:
The patent transitions from vertical stacking arrangement to horizontal co-planar arrangement within the same layer, using dimensional reconfiguration to achieve both electrical connection and size miniaturization simultaneously
3Quantity of substance
If film capacitor with thin dielectric layer is used, then capacitance density is improved, but reliability decreases due to ion migration and short circuit
Solution Approach 1:
The patent changes the dielectric material from thin polymer film to glass with significantly higher breakdown strength and lower ion migration rate, fundamentally altering material parameters to achieve both high capacitance density and high reliability
4Quantity of substance
If polymer dielectric is repetitively laminated to form insulating layers, then embedded capacitor and inductor structure is achieved, but processing complexity and cost increase
Solution Approach 1:
The patent extracts the dielectric function from multiple laminated polymer layers and consolidates it into a single glass substrate, eliminating the need for repetitive lamination processes and reducing manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables miniaturization, reduces signal loss and parasitic inductance, improves reliability by preventing ion migration, and simplifies processing, making it suitable for high-frequency applications while lowering costs.
Implementation Method 1
the glass medium has a low dielectric constant Dk and a low dielectric loss Df, so that the signal loss and the parasitic inductance can be reduced
Implementation Method 2
the dielectric layer and the lower electrode are conductively connected by a metal via pillar passing through the glass substrate
Data Source
AI summary
A passive device packaging structure embedded in a glass medium according to an embodiment of the present disclosures includes a glass substrate and at least one capacitor embedded in the glass substrate. The capacitor includes an upper electrode, a dielectric layer, and a lower electrode. The glass substrate is provided on its upper surface with a cavity, the dielectric layer covers a surface of the cavity and has an area larger than that of the cavity. The upper electrode is provided on the dielectric layer. The dielectric layer and the lower electrode are connected by a metal via pillar passing through the glass substrate.